Inventor · disambiguated record
Masayuki Oba
Also filed as: OBA MASAYUKI
17 granted patents·515 citations·filing 1978–1998
95Inventor score
Top patents by PatentIndex Score
17 records- 0192US4289699AProcess for the production of N-(hydroxyphenyl) maleimidesMITSUI TOATSU CHEMICALS·Filed 1979·Granted Sep 15, 1981·22 cites·9 claims
- 0290US4323662AThermosetting resin compositions comprising bismaleimides and alkenylaniline derivativesMITSUI TOATSU CHEMICALS·Filed 1980·Granted Apr 6, 1982·55 cites·11 claims
- 0390US4231934AProcess for the production of N-(hydroxyphenyl) maleimidesMITSUI TOATSU CHEMICALS·Filed 1978·Granted Nov 4, 1980·18 cites·12 claims
- 0487US5756650APolyimide precursor composition, method of forming polyimide film, electronic parts and liquid crystal elementTOSHIBA KK·Filed 1997·Granted May 26, 1998·68 cites·20 claims
- 0584US5585217APolyamic acid compositionTOSHIBA KK·Filed 1995·Granted Dec 17, 1996·46 cites·8 claims
- 0683US4401777ACurable resin composition comprising N-(alkenylphenyl)maleimide and epoxy compositionMITSUI TOATSU CHEMICALS·Filed 1981·Granted Aug 30, 1983·33 cites·28 claims
- 0781US5348835APhotosensitive resin composition for forming polyimide film pattern comprising an o-quinone diazide photosensitive agentTOSHIBA KK·Filed 1991·Granted Sep 20, 1994·33 cites·7 claims
- 0879US5518864AMethod of forming polyimide film patternTOSHIBA KK·Filed 1994·Granted May 21, 1996·31 cites·12 claims
- 0977US4500719AProcess for the preparation of N-alkenylphenylmaleimides and N,N'-[alkenylenephenylene]bismalemidesMITSUI TOATSU CHEMICALS·Filed 1982·Granted Feb 19, 1985·11 cites·20 claims
- 1074US5578697APolyimide precursor, bismaleimide-based cured resin precursor and electronic parts having insulating members made from these precursorsTOSHIBA KK·Filed 1995·Granted Nov 26, 1996·48 cites·20 claims
- 1173US6159654ANegative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heatingTOSHIBA KK·Filed 1998·Granted Dec 12, 2000·44 cites·9 claims
- 1267US4376206AN-Alkenylphenylmaleimides and N,N'-[alkenylene phenylene]bismaleimides for the sameMITSUI TOATSU CHEMICALS·Filed 1980·Granted Mar 8, 1983·6 cites·11 claims
- 1366US5340684APhotosensitive composition and resin-encapsulated semiconductor deviceTOSHIBA KK·Filed 1993·Granted Aug 23, 1994·40 cites·18 claims
- 1464US4400521AN-Substituted phenyl maleimidesMITSUI TOATSU CHEMICALS·Filed 1980·Granted Aug 23, 1983·5 cites·6 claims
- 1560US5756254AResist, method of forming a resist pattern and manufacturing an electronic parts using the resistTOSHIBA KK·Filed 1996·Granted May 26, 1998·25 cites·22 claims
- 1660US5753407APolyamic acid compositionTOSHIBA KK·Filed 1996·Granted May 19, 1998·25 cites·18 claims
- 1740US4506042ACurable resin composition comprising N-(alkenylphenyl)maleimide, epoxy composition and polyamineMITSUI TOATSU CHEMICALS·Filed 1983·Granted Mar 19, 1985·5 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →