Inventor · disambiguated record
Masayuki Ochiai
Also filed as: OCHIAI MASAYUKI
17 granted patents·1 pending application·798 citations·filing 1987–2018
95Inventor score
Top patents by PatentIndex Score
18 records- 0195US5643831AProcess for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor deviceFUJITSU LTD·Filed 1995·Granted Jul 1, 1997·231 cites·13 claims
- 0295US5284796AProcess for flip chip connecting a semiconductor chipFUJITSU LTD·Filed 1992·Granted Feb 8, 1994·237 cites·6 claims
- 0386US6025258AMethod for fabricating solder bumps by forming solder balls with a solder ball forming memberFUJITSU LTD·Filed 1995·Granted Feb 15, 2000·94 cites·41 claims
- 0479US6689639B2Method of making semiconductor deviceFUJITSU LTD·Filed 2002·Granted Feb 10, 2004·30 cites·27 claims
- 0577US6319810B1Method for forming solder bumpsFUJITSU LTD·Filed 1996·Granted Nov 20, 2001·55 cites·6 claims
- 0676US6528346B2Bump-forming method using two plates and electronic deviceFUJITSU LTD·Filed 2000·Granted Mar 4, 2003·24 cites·3 claims
- 0774US7604152B2Method for manufacturing a printed circuit board for electronic devices and an electronic device using the sameFUJITSU LTD·Filed 2006·Granted Oct 20, 2009·6 cites·18 claims
- 0870US6712513B2Fluid bearing deviceNSK LTD·Filed 2001·Granted Mar 30, 2004·12 cites·25 claims
- 0969US4759490AMethod for soldering electronic components onto a printed wiring board using a solder pasteFUJITSU LTD·Filed 1987·Granted Jul 26, 1988·28 cites·15 claims
- 1060US6867378B2Solder paste and terminal-to-terminal connection structureFUJITSU LTD·Filed 2002·Granted Mar 15, 2005·8 cites·11 claims
- 1160US5959346AMethod for fabricating metal bumps onto electronic deviceFUJITSU LTD·Filed 1997·Granted Sep 28, 1999·22 cites·12 claims
- 1258US6596094B2Solder paste and electronic deviceFUJITSU LTD·Filed 2001·Granted Jul 22, 2003·7 cites·21 claims
- 1356US6140286ADefluxing agent cleaning method and cleaning apparatusFUJITSU LTD·Filed 1997·Granted Oct 31, 2000·9 cites·6 claims
- 1455US5616164AMethods for making metal particle spherical and removing oxide film solder paste and soldering methodFUJITSU LTD·Filed 1995·Granted Apr 1, 1997·18 cites·14 claims
- 1554US5695571ACleaning method using a defluxing agentFUJITSU LTD·Filed 1994·Granted Dec 9, 1997·12 cites·24 claims
- 1640US6050479ADefluxing agent cleaning method and cleaning apparatusFUJITSU LTD·Filed 1997·Granted Apr 18, 2000·5 cites·9 claims
- 1735US2001028109A1Solder alloy, a circuit substrate, a semiconductor device and a method of manufacturing the sameFiled 2000·Application pending·0 cites
- 1834US11293876B2Fluid measurement method, fluid measurement device, and measurement systemTOKAI UNIV EDUCATIONAL SYSTEM·Filed 2018·Granted Apr 5, 2022·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →