Inventor · disambiguated record
Masaaki Ogihara
Also filed as: OGIHARA MASAAKI
7 granted patents·5 pending applications·14 citations·filing 1993–2025
73Inventor score
Top patents by PatentIndex Score
12 records- 0188US12064920B2Material feeding device, three-dimensional shaping device, and injection molding deviceSEIKO EPSON CORP·Filed 2022·Granted Aug 20, 2024·1 cites·12 claims
- 0264US2025162257A1Three-dimensionally shaping apparatusSEIKO EPSON CORP·Filed 2024·Application pending·0 cites
- 0362US12240171B2Material dispense device, three-dimensional shaping device, and injection molding deviceSEIKO EPSON CORP·Filed 2023·Granted Mar 4, 2025·0 cites·10 claims
- 0462US2025367884A1Material supplying device, three dimensional molding device, and injection molding deviceSEIKO EPSON CORP·Filed 2025·Application pending·0 cites
- 0561US12508767B2Method of manufacturing three-dimensional shaped object, and three-dimensional shaping systemSEIKO EPSON CORP·Filed 2023·Granted Dec 30, 2025·0 cites·8 claims
- 0659US2024326330A1Material discharge device and three-dimensional modeling deviceSEIKO EPSON CORP·Filed 2024·Application pending·0 cites
- 0758US12485616B2Three-dimensional shaping device and three-dimensional shaped object manufacturing methodSEIKO EPSON CORP·Filed 2023·Granted Dec 2, 2025·0 cites·7 claims
- 0858US2024033999A1Plasticizing Device, Three-Dimensional Shaping Device, And Injection Molding DeviceSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0956US2023094570A1Three-Dimensional Shaping Device And Plasticized Material Dispensing DeviceSEIKO EPSON CORP·Filed 2022·Application pending·0 cites
- 1047US12194500B2Classifying rotor and classifying apparatusSATAKE CHEM EQUIP MFG·Filed 2018·Granted Jan 14, 2025·0 cites·5 claims
- 1142US10890515B2Classifying apparatusSATAKE CHEM EQUIP MFG·Filed 2019·Granted Jan 12, 2021·0 cites·4 claims
- 1240US5303117AElectrostatic positionerISHIKAWAJIMA HARIMA HEAVY IND·Filed 1993·Granted Apr 12, 1994·13 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →