Inventor · disambiguated record
Manabu Ogiwara
Also filed as: OGIWARA MANABU
2 granted patents·1 pending application·17 citations·filing 1998–2004
58Inventor score
Top patents by PatentIndex Score
3 records- 0155US6716923B1Resin composition for powder moldingZEON KASEI KK·Filed 2000·Granted Apr 6, 2004·5 cites·7 claims
- 0249US5994439AVinyl chloride resin composition for powder moldingZEON KASAI CO LTD·Filed 1998·Granted Nov 30, 1999·12 cites·6 claims
- 0342US2007169885A1Thermally conductive pressure-sensitive adhesive composition, thermally conductive sheet-form molded foam, and process for producing the sameMIKUNI TAKAMITU·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →