Inventor · disambiguated record
Masayuki Ohayashi
Also filed as: OHAYASHI MASAYUKI
11 granted patents·1 pending application·254 citations·filing 1990–2008
92Inventor score
Top patents by PatentIndex Score
12 records- 0185US5457412ASemiconductor integrated circuit device including input circuitry to permit operation of a Bi-CMOS memory with ECL level input signalsHITACHI LTD·Filed 1993·Granted Oct 10, 1995·47 cites·9 claims
- 0280US5360988ASemiconductor integrated circuit device and methods for production thereofHITACHI LTD·Filed 1992·Granted Nov 1, 1994·61 cites·14 claims
- 0374US5354699AMethod of manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1992·Granted Oct 11, 1994·33 cites·12 claims
- 0470US7247553B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Jul 24, 2007·17 cites·6 claims
- 0567US5519658ASemiconductor integrated circuit device and methods for production thereofHITACHI LTD·Filed 1994·Granted May 21, 1996·34 cites·29 claims
- 0664US7365376B2Semiconductor integrated circuitRENESAS TECH CORP·Filed 2006·Granted Apr 29, 2008·2 cites·6 claims
- 0760US7119383B2Arrangement of wiring lines including power source lines and channel wirings of a semiconductor integrated circuit having plural cellsRENESAS TECH CORP·Filed 2003·Granted Oct 10, 2006·7 cites·23 claims
- 0859US5512497AMethod of manufacturing a semiconductor integrated circuit deviceHITACHI LTD·Filed 1994·Granted Apr 30, 1996·17 cites·26 claims
- 0956US5255225ASemiconductor integrated circuit device and memory consisting of semiconductor integrated circuitHITACHI LTD·Filed 1992·Granted Oct 19, 1993·18 cites·28 claims
- 1055US5057894ASemiconductor integrated circuit deviceHITACHI LTD·Filed 1990·Granted Oct 15, 1991·18 cites·14 claims
- 1152US7476915B2Semiconductor integrated circuit including a first region and a second regionRENESAS TECH CORP·Filed 2008·Granted Jan 13, 2009·0 cites·7 claims
- 1244US2004210738A1On-chip multiprocessorFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →