Inventor · disambiguated record
Makoto Ohkawa
Also filed as: OHKAWA MAKOTO · SUGISAKA TAKAYUKI
11 granted patents·1 pending application·213 citations·filing 1987–2007
91Inventor score
Top patents by PatentIndex Score
12 records- 0188US6645045B2Method of measuring thickness of a semiconductor layer and method of manufacturing a semiconductor substrateDENSO CORP·Filed 2002·Granted Nov 11, 2003·57 cites·18 claims
- 0272US6279585B1Etching method and method for manufacturing semiconductor device using the sameDENSO CORP·Filed 1999·Granted Aug 28, 2001·40 cites·18 claims
- 0372US5525831ASemiconductor device with thin film resistor having reduced film thickness sensitivity during trimming processNIPPON DENSO CO·Filed 1994·Granted Jun 11, 1996·33 cites·18 claims
- 0466US6809034B2Method of etching metallic thin film on thin film resistorDENSO CORP·Filed 2002·Granted Oct 26, 2004·9 cites·27 claims
- 0562US6656755B1Method for manufacturing semiconductor device by polishingDENSO CORP·Filed 2000·Granted Dec 2, 2003·11 cites·9 claims
- 0662US5625218ASemiconductor device equipped with a heat-fusible thin film resistor and production method thereofNIPPON DENSO CO·Filed 1995·Granted Apr 29, 1997·28 cites·21 claims
- 0755US7199026B2Semiconductor device, cutting equipment for cutting semiconductor device, and method for cutting the sameDENSO CORP·Filed 2004·Granted Apr 3, 2007·4 cites·22 claims
- 0854US5989970AMethod for fabricating semiconductor device having thin-film resistorNIPPON DENSO CO·Filed 1996·Granted Nov 23, 1999·16 cites·12 claims
- 0951US6645875B2Method of processing metal and method of manufacturing semiconductor device using the metalDENSO CORP·Filed 2001·Granted Nov 11, 2003·3 cites·8 claims
- 1050US2007235842A1Semiconductor device and cutting equipment for cutting semiconductor deviceDENSO CORP·Filed 2007·Application pending·0 cites
- 1142US6770564B1Method of etching metallic thin film on thin film resistorDENSO CORP·Filed 1999·Granted Aug 3, 2004·7 cites·18 claims
- 1235US4829029ALow temperature sintering ceramic material composition and process for producing the low temperature sintering ceramicNIPPON DENSO CO·Filed 1987·Granted May 9, 1989·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →