Inventor · disambiguated record
Masashi Ohkoshi
Also filed as: OHKOSHI Masashi
0 granted patents·7 pending applications·0 citations·filing 2021–2023
Top patents by PatentIndex Score
7 records- 0165US2024352287A1Curable adhesive composition, filmy adhesive, method for producing multilayered wiring board, and multilayered wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 0253US2025159815A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring memberRESONAC CORP·Filed 2023·Application pending·0 cites
- 0353US2025142722A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring memberRESONAC CORP·Filed 2023·Application pending·0 cites
- 0452US2025024609A1Wiring-forming member, wiring layer forming method using wiring-forming member, and wiring-formed memberRESONAC CORP·Filed 2022·Application pending·0 cites
- 0550US2024079345A1Electroconductive member, method for manufacturing electronic device, connection structure, and electronic deviceSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 0649US2023397337A1Method for manufacturing substrate with built-in components, and substrate with built-in componentsSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 0747US2023328897A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and wiring forming memberSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →