Inventor · disambiguated record
Masanori Okamoto
Also filed as: OKAMOTO MASANORI
10 granted patents·6 pending applications·7 citations·filing 2009–2025
79Inventor score
Top patents by PatentIndex Score
16 records- 0194US11784459B2Electrical element mounting package, array package, and electrical deviceKYOCERA CORP·Filed 2021·Granted Oct 10, 2023·5 cites·13 claims
- 0275US2025365857A1Multilayer substrate, electronic device, and method for manufacturing multilayer substrateMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 0365US2025380350A1Multilayer substrate and electronic deviceMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 0463US8885312B2ESD protection device and manufacturing method thereofSUMI TAKAHIRO·Filed 2012·Granted Nov 11, 2014·2 cites·20 claims
- 0561US12230423B2Transmission line and electronic deviceMURATA MANUFACTURING CO·Filed 2023·Granted Feb 18, 2025·0 cites·18 claims
- 0655US2024055745A1Multilayer substrate and electronic deviceMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 0754US9814124B2Surge protection device, method for manufacturing the same, and electronic component including the sameMURATA MANUFACTURING CO·Filed 2015·Granted Nov 7, 2017·0 cites·9 claims
- 0851US2023291086A1Transmission line and electronic deviceMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 0950US10862264B2Light-emitting element housing member, array member, and light-emitting deviceKYOCERA CORP·Filed 2017·Granted Dec 8, 2020·0 cites·13 claims
- 1047US11856713B2Multilayer resin substrate and method of manufacturing multilayer resin substrateMURATA MANUFACTURING CO·Filed 2021·Granted Dec 26, 2023·0 cites·10 claims
- 1146US12198992B2Electronic element housing package and electronic apparatusKYOCERA CORP·Filed 2020·Granted Jan 14, 2025·0 cites·7 claims
- 1245US2019214784A1Electrical element mounting package, array package, and electrical deviceKYOCERA CORP·Filed 2017·Application pending·0 cites
- 1344US9743502B2ESD protection deviceMURATA MANUFACTURING CO·Filed 2015·Granted Aug 22, 2017·0 cites·20 claims
- 1443US10980112B2Multilayer wiring boardMURATA MANUFACTURING CO·Filed 2019·Granted Apr 13, 2021·0 cites·29 claims
- 1540US10396002B2Electronic component storage substrate and housing packageKYOCERA CORP·Filed 2016·Granted Aug 27, 2019·0 cites·20 claims
- 1637US2010164125A1Method of evaluating the flame retardancy of sealing resin and test sample for evaluation of flame retardancyTOSHIBA KK·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →