Inventor · disambiguated record
Masao Okihara
Also filed as: OKIHARA MASAO
25 granted patents·7 pending applications·160 citations·filing 1996–2022
94Inventor score
Files withOKI ELECTRIC IND CO LTD12LAPIS SEMICONDUCTOR CO LTD10OKI SEMICONDUCTOR CO LTD6OKIHARA MASAO2ARAI YASUO1
Top patents by PatentIndex Score
32 records- 0182US5892225AMethod of preparing a plan-view sample of an integrated circuit for transmission electron microscopy, and methods of observing the sampleOKI ELECTRIC IND CO LTD·Filed 1996·Granted Apr 6, 1999·64 cites·20 claims
- 0280US9899448B2Semiconductor device having SOI substrateLAPIS SEMICONDUCTOR CO LTD·Filed 2016·Granted Feb 20, 2018·2 cites·7 claims
- 0377US9978783B2Semiconductor device and manufacturing method of semiconductor deviceLAPIS SEMICONDUCTOR CO LTD·Filed 2017·Granted May 22, 2018·2 cites·12 claims
- 0475US7205190B2Semiconductor device fabrication methodOKI ELECTRIC IND CO LTD·Filed 2004·Granted Apr 17, 2007·21 cites·20 claims
- 0575US6876039B2Variable threshold voltage complementary MOSFET with SOI structureOKI ELECTRIC IND CO LTD·Filed 2003·Granted Apr 5, 2005·21 cites·6 claims
- 0670US9136386B2SOI substrate, method of manufacturing the SOI substrate, semiconductor device, and method of manufacturing the semiconductor deviceOKIHARA MASAO·Filed 2012·Granted Sep 15, 2015·3 cites·23 claims
- 0770US8049291B2Semiconductor optical sensor having an inter-region light-shielding plugOKI SEMICONDUCTOR CO LTD·Filed 2008·Granted Nov 1, 2011·2 cites·12 claims
- 0868US8963246B2Semiconductor device and method for manufacturing semiconductor deviceARAI YASUO·Filed 2011·Granted Feb 24, 2015·2 cites·4 claims
- 0967US7087967B2LSI device having core and interface regions with SOI layers of different thicknessOKI ELECTRIC IND CO LTD·Filed 2003·Granted Aug 8, 2006·13 cites·6 claims
- 1065US8071415B2Method of fabricating semiconductor deviceOKAMURA TOMOHIRO·Filed 2010·Granted Dec 6, 2011·1 cites·3 claims
- 1165US6849883B2Strained SOI MOSFET device and method of fabricating sameOKI ELECTRIC IND CO LTD·Filed 2003·Granted Feb 1, 2005·12 cites·22 claims
- 1261US2023097075A1Measuring apparatus, measuring method, and ion-sensitive semiconductor deviceLAPIS SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 1360US10622263B2Semiconductor device having SOI substrate and first and second diffusion layerLAPIS SEMICONDUCTOR CO LTD·Filed 2018·Granted Apr 14, 2020·0 cites·5 claims
- 1459US8362562B2Semiconductor device with selected transistor propertiesLAPIS SEMICONDUCTOR CO LTD·Filed 2010·Granted Jan 29, 2013·1 cites·5 claims
- 1556US11360041B2Reference electrodeLAPIS SEMICONDUCTOR CO LTD·Filed 2018·Granted Jun 14, 2022·0 cites·15 claims
- 1655US8217361B2Ultraviolet sensorOKIHARA MASAO·Filed 2008·Granted Jul 10, 2012·0 cites·8 claims
- 1754US11041824B2Measurement device and measurement methodLAPIS SEMICONDUCTOR CO LTD·Filed 2019·Granted Jun 22, 2021·0 cites·7 claims
- 1854US9318391B2Method for manufacturing semiconductor device including a MOS-type transistorLAPIS SEMICONDUCTOR CO LTD·Filed 2015·Granted Apr 19, 2016·0 cites·6 claims
- 1953US10559607B2Semiconductor device and manufacturing method of semiconductor deviceLAPIS SEMICONDUCTOR CO LTD·Filed 2018·Granted Feb 11, 2020·0 cites·13 claims
- 2052US7648848B2Semiconductor integrated circuit production method and device including preparing a plurality of SOI substrates, grouping SOI substrates having mutual similarities and adjusting their layer thicknesses simultaneouslyOKI SEMICONDUCTOR CO LTD·Filed 2008·Granted Jan 19, 2010·1 cites·14 claims
- 2148US7300851B2Method of fabricating a silicon-on-insulator device with a channel stopOKI ELECTRIC IND CO LTD·Filed 2006·Granted Nov 27, 2007·0 cites·6 claims
- 2248US6075270AField effect transistorOKI ELECTRIC IND CO LTD·Filed 1998·Granted Jun 13, 2000·11 cites·4 claims
- 2348US2008185651A1SOI type semiconductor device having a protection circuitOKI ELECTRIC IND CO LTD·Filed 2008·Application pending·0 cites
- 2446US7985638B2Method of manufacturing semiconductor deviceOKI SEMICONDUCTOR CO LTD·Filed 2009·Granted Jul 26, 2011·0 cites·3 claims
- 2545US7112501B2Method of fabrication a silicon-on-insulator device with a channel stopOKI ELECTRIC IND CO LTD·Filed 2003·Granted Sep 26, 2006·1 cites·11 claims
- 2643US2011101458A1SOI type semiconductor device having a protection circuitOKI SEMICONDUCTOR CO LTD·Filed 2011·Application pending·0 cites
- 2742US9876126B2Semiconductor device and semiconductor device manufacturing methodLAPIS SEMICONDUCTOR CO LTD·Filed 2016·Granted Jan 23, 2018·0 cites·14 claims
- 2842US2008237801A1Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2008·Application pending·0 cites
- 2939US2007080404A1Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2006·Application pending·0 cites
- 3037US6362474B1Semiconductor sample for transmission electron microscope and method of manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 1999·Granted Mar 26, 2002·3 cites·6 claims
- 3136US2011117741A1Method of fabricating SOI waferOKI SEMICONDUCTOR CO LTD·Filed 2010·Application pending·0 cites
- 3236US2011204444A1Semiconductor intergrated device and method of manufacturing sameOKI SEMICONDUCTOR CO LTD·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →