Inventor · disambiguated record
Makoto Orikasa
Also filed as: ORIKASA MAKOTO
30 granted patents·1 pending application·39 citations·filing 2008–2021
94Inventor score
Top patents by PatentIndex Score
31 records- 0193US9818736B1Method for producing semiconductor packageTDK CORP·Filed 2017·Granted Nov 14, 2017·11 cites·4 claims
- 0292US11031330B2Electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2020·Granted Jun 8, 2021·3 cites·13 claims
- 0384US11869834B2Electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2021·Granted Jan 9, 2024·1 cites·12 claims
- 0483US10867898B2Electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2018·Granted Dec 15, 2020·3 cites·13 claims
- 0583US10374301B2Wiring componentTDK CORP·Filed 2017·Granted Aug 6, 2019·4 cites·9 claims
- 0678US8083922B2Tin electrolytic plating solution for electronic parts, method for tin electrolytic plating of electronic parts, and tin electroplated electronic partsORIKASA MAKOTO·Filed 2008·Granted Dec 27, 2011·3 cites·8 claims
- 0773US8933336B2Coating and electronic componentTDK CORP·Filed 2012·Granted Jan 13, 2015·3 cites·7 claims
- 0872US9293421B2Electronic component moduleTDK CORP·Filed 2015·Granted Mar 22, 2016·2 cites·6 claims
- 0972US9257402B2Terminal structure, and semiconductor element and module substrate comprising the sameTDK CORP·Filed 2013·Granted Feb 9, 2016·3 cites·7 claims
- 1069US9620156B2Magnetic head deviceTDK CORP·Filed 2016·Granted Apr 11, 2017·2 cites·12 claims
- 1168US9070606B2Terminal structure and semiconductor deviceTDK CORP·Filed 2013·Granted Jun 30, 2015·2 cites·6 claims
- 1267US11613100B2Noise suppression sheetTDK CORP·Filed 2020·Granted Mar 28, 2023·0 cites·5 claims
- 1366US9640500B2Terminal structure and semiconductor deviceTDK CORP·Filed 2013·Granted May 2, 2017·2 cites·9 claims
- 1465US11516951B2Noise suppression sheetTDK CORP·Filed 2020·Granted Nov 29, 2022·0 cites·3 claims
- 1563US11410855B2Method of producing electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2020·Granted Aug 9, 2022·0 cites·13 claims
- 1662US11419250B2Noise suppression sheetTDK CORP·Filed 2020·Granted Aug 16, 2022·0 cites·8 claims
- 1760US11668008B2Sheet material, metal mesh, wiring substrate, display device and manufacturing methods thereforTDK CORP·Filed 2020·Granted Jun 6, 2023·0 cites·11 claims
- 1855US10354973B2Method for producing semiconductor chipTDK CORP·Filed 2018·Granted Jul 16, 2019·0 cites·11 claims
- 1953US10784122B2Method of producing electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2018·Granted Sep 22, 2020·0 cites·10 claims
- 2053US8787028B2Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structureTDK CORP·Filed 2012·Granted Jul 22, 2014·0 cites·11 claims
- 2152US10163847B2Method for producing semiconductor packageTDK CORP·Filed 2017·Granted Dec 25, 2018·0 cites·19 claims
- 2251US10968519B2Sheet material, metal mesh, wiring substrate, display device and manufacturing methods thereforTDK CORP·Filed 2018·Granted Apr 6, 2021·0 cites·2 claims
- 2350US11466368B2Sheet material, metal mesh and manufacturing methods thereofTDK CORP·Filed 2018·Granted Oct 11, 2022·0 cites·15 claims
- 2450US2013192873A1Structure body and electronic component and printed wiring board including the sameTDK CORP·Filed 2012·Application pending·0 cites
- 2549US11088308B2Junction structureTDK CORP·Filed 2020·Granted Aug 10, 2021·0 cites·7 claims
- 2649US9177687B2Coating and electronic componentTDK CORP·Filed 2012·Granted Nov 3, 2015·0 cites·17 claims
- 2747US8970037B2Terminal structure, and semiconductor element and module substrate comprising the sameTDK CORP·Filed 2013·Granted Mar 3, 2015·0 cites·5 claims
- 2846US11804654B2Coil component and wireless communication circuit using the sameTDK CORP·Filed 2021·Granted Oct 31, 2023·0 cites·19 claims
- 2946US10304779B2Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereofTDK CORP·Filed 2017·Granted May 28, 2019·0 cites·7 claims
- 3039US10354796B2Method for manufacturing planar coilTDK CORP·Filed 2017·Granted Jul 16, 2019·0 cites·12 claims
- 3135US9514772B2Magnetic head device having suspension and spacerTDK CORP·Filed 2016·Granted Dec 6, 2016·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →