Inventor · disambiguated record

Masahisa Ose

Also filed as: OSE MASAHISA

2 granted patents·1 pending application·27 citations·filing 2000–2024

55Inventor score

Technology areasH10W Y10T

Files withHITACHI CHEMICAL CO LTD1 RESONAC CORP1 SHOWA DENKO MATERIALS CO LTD1

Top patents by PatentIndex Score

3 records

0181US6524717B1Prepreg, metal-clad laminate, and printed circuit board obtained from theseHITACHI CHEMICAL CO LTD·Filed 2000·Granted Feb 25, 2003·27 cites·25 claims
0266US2024173927A1Laminate, printed wiring board, semiconductor package, and method for manufacturing laminateRESONAC CORP·Filed 2024·Application pending·0 cites
0354US11938688B2Laminate, printed wiring board, semiconductor package, and method for manufacturing laminateSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Mar 26, 2024·0 cites·10 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →