Inventor · disambiguated record
Masahiro Oura
Also filed as: OURA MASAHIRO
9 granted patents·6 pending applications·163 citations·filing 1997–2012
89Inventor score
Top patents by PatentIndex Score
15 records- 0184US7534478B2Release liner and pressure-sensitive adhesive tape or sheet employing the sameNITTO DENKO CORP·Filed 2005·Granted May 19, 2009·7 cites·10 claims
- 0279US7927697B2Double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board and wiring circuit boardNITTO DENKO CORP·Filed 2007·Granted Apr 19, 2011·5 cites·9 claims
- 0373US6207272B1Peelable heat-conductive and pressure-sensitive adhesive and adhesive sheet containing the sameNITTO DENKO CORP·Filed 1998·Granted Mar 27, 2001·39 cites·1 claims
- 0471US6299975B1Pressure-sensitive adhesive sheets comprising photo-polymerization product and production method thereofNITTO DENKO CORP·Filed 1999·Granted Oct 9, 2001·35 cites·5 claims
- 0563US6194063B1Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the sameNITTO DENKO CORP·Filed 1999·Granted Feb 27, 2001·30 cites·8 claims
- 0657US2009263606A1Thermosetting adhesive or pressure-sensitive adhesive tape or sheetNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 0755US2012111622A1Double-Sided Pressure-Sensitive Adhesive Tape or Sheet For Use In Wiring Circuit Board And Wiring Circuit Board Having The Double-Sided Pressure-Sensitive Ahesive TapeDAIGAKU NORITSUGU·Filed 2012·Application pending·0 cites
- 0853US6284368B2Photopolymerizable composition, pressure-sensitive flame-retardant adhesive, and adhesive sheetsNITTO DENKO CORP·Filed 1997·Granted Sep 4, 2001·15 cites·6 claims
- 0952US6211261B1Thermosetting pressure-sensitive adhesive and adhesive sheet thereofNITTO DENKO CORP·Filed 1999·Granted Apr 3, 2001·18 cites·12 claims
- 1050US2008248231A1Double-sided pressure-sensitive adhesive tape or sheet for use in wiring circuit board and wiring circuit board having the double-sided pressure-sensitive adhesive tapeNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1144US2010183872A1Double-coated pressure sensitive adhesive sheet for fixing flexible printed circuit boardNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1242US2012111612A1Thermosetting adhesive tape or sheet, and flexible printed circuit boardKUWAHARA RIE·Filed 2010·Application pending·0 cites
- 1338US6086994AHeat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating member using the sameNITTO DENKO CORP·Filed 1998·Granted Jul 11, 2000·8 cites·6 claims
- 1435US6261685B1Thermosetting adhesive and adhesive sheet thereofNITTO DENKO CORP·Filed 1999·Granted Jul 17, 2001·6 cites·14 claims
- 1532US2010209649A1Double-coated pressure sensitive adhesive sheetNITTO DENKO CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →