Inventor · disambiguated record
Maria Angela Damille Ramiso
Also filed as: RAMISO MARIA ANGELA DAMILLE
3 granted patents·1 citations·filing 2018–2020
46Inventor score
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0167US11399434B2Electronic package and method of forming an electronic packageINTEL CORP·Filed 2018·Granted Jul 26, 2022·1 cites·21 claims
- 0247US11495547B2Fiber reinforced stiffenerINTEL CORP·Filed 2018·Granted Nov 8, 2022·0 cites·19 claims
- 0338US12165983B2Stepped electronic substrate for integrated circuit packagesINTEL CORP·Filed 2020·Granted Dec 10, 2024·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →