Inventor · disambiguated record
Matthew Reiss
Also filed as: REISS MATTHEW · REISS MATTHEW M
4 granted patents·1 pending application·86 citations·filing 2001–2023
74Inventor score
Top patents by PatentIndex Score
5 records- 0187US6667557B2Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connectionsIBM·Filed 2003·Granted Dec 23, 2003·43 cites·16 claims
- 0286US6570259B2Apparatus to reduce thermal fatigue stress on flip chip solder connectionsIBM·Filed 2001·Granted May 27, 2003·43 cites·19 claims
- 0349US2024394433A1Application programming interface simulation system and methodCAPITAL ONE SERVICES LLC·Filed 2023·Application pending·0 cites
- 0440US6989607B2Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriersIBM·Filed 2003·Granted Jan 24, 2006·0 cites·12 claims
- 0539US6639302B2Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carriesIBM·Filed 2002·Granted Oct 28, 2003·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →