Inventor · disambiguated record
Martin Reiss
Also filed as: REISS MARTIN · REISS MARTIN H
29 granted patents·19 pending applications·281 citations·filing 1975–2018
96Inventor score
Top patents by PatentIndex Score
48 records- 0192US7271484B2Substrate for producing a soldering connectionINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 18, 2007·110 cites·14 claims
- 0284US9893230B2Producing a lighting moduleOSRAM GMBH·Filed 2016·Granted Feb 13, 2018·4 cites·20 claims
- 0383US3988726AInfrared intrusion detection apparatusGULF & WESTERN MFG CO·Filed 1975·Granted Oct 26, 1976·33 cites·17 claims
- 0480US6525416B2Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing themINFINEON TECHNOLOGIES AG·Filed 2001·Granted Feb 25, 2003·32 cites·15 claims
- 0578US6873060B2Electronic component with a semiconductor chip, method of producing an electronic component and a panel with a plurality of electronic componentsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 29, 2005·24 cites·17 claims
- 0672US7256070B2Substrate-based housing component with a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 14, 2007·6 cites·10 claims
- 0771US7368322B2Method for mounting a chip on a base and arrangement produced by this methodINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 6, 2008·6 cites·24 claims
- 0868US7223639B2Method of producing an electronic component and a panel with a plurality of electronic componentsINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 29, 2007·14 cites·12 claims
- 0966US10054292B2Lighting device and method of manufacturing itOSRAM GMBH·Filed 2016·Granted Aug 21, 2018·1 cites·12 claims
- 1063US7245013B2Substrate based IC-packageINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 17, 2007·3 cites·20 claims
- 1163US6664648B2Apparatus for applying a semiconductor chip to a carrier element with a compensating layerINFINEON TECHNOLOGIES AG·Filed 2001·Granted Dec 16, 2003·10 cites·12 claims
- 1260US6906928B2Electronic component with a semiconductor chip, and method of producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 14, 2005·10 cites·22 claims
- 1357US7906421B2Method for applying solder to redistribution linesQIMONDA AG·Filed 2007·Granted Mar 15, 2011·1 cites·28 claims
- 1457US7030473B2Substrate-based IC packageINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 18, 2006·8 cites·12 claims
- 1555US6486538B1Chip carrier having ventilation channelsINFINEON TECHNOLOGIES AG·Filed 2000·Granted Nov 26, 2002·7 cites·4 claims
- 1649US6998296B2Electronic component and method for its productionINFINEON TECHNOLOGIES AG·Filed 2004·Granted Feb 14, 2006·3 cites·14 claims
- 1747US2013209675A1Method for providing a substrate with luminous materialOSRAM GMBH·Filed 2013·Application pending·0 cites
- 1845US9923129B2Method for producing an LED module and LED moduleOSRAM GMBH·Filed 2013·Granted Mar 20, 2018·0 cites·19 claims
- 1945US6949820B2Substrate-based chip packageINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 27, 2005·2 cites·16 claims
- 2045US2014104838A1Lighting apparatus productionOSRAM GMBH·Filed 2013·Application pending·0 cites
- 2143US10281090B2Lighting device and corresponding manufacturing methodOSRAM GMBH·Filed 2018·Granted May 7, 2019·0 cites·12 claims
- 2242US9696004B2Lighting device and corresponding methodOSRAM GMBH·Filed 2015·Granted Jul 4, 2017·0 cites·9 claims
- 2342US7229857B2Method for producing a protection for chip edges and system for the protection of chip edgesINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 12, 2007·2 cites·13 claims
- 2442US6933595B2Electronic device and leadframe and methods for producing the electronic device and the leadframeINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 23, 2005·2 cites·27 claims
- 2541US7384822B2Package for semiconductor components and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jun 10, 2008·2 cites·20 claims
- 2641US7180162B2Arrangement for reducing stress in substrate-based chip packagesINFINEON TECHNOLOGIES AG·Filed 2004·Granted Feb 20, 2007·1 cites·19 claims
- 2741US7008493B2Method for applying a semiconductor chip to a carrier elementINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 7, 2006·0 cites·7 claims
- 2840US9249940B2Lighting device and method for producing a lighting deviceREISS MARTIN·Filed 2012·Granted Feb 2, 2016·0 cites·14 claims
- 2940US2007221325A1Accelerated B-Stage curing process for thermosetting resins and FBGA assembly process utilizing the accelerated B-Stage curing processCARDOSO ANDRE·Filed 2006·Application pending·0 cites
- 3037US2005252598A1Viscous adhesive material for fastening electronic componentsREISS MARTIN·Filed 2005·Application pending·0 cites
- 3136US7036216B2Method and apparatus for connecting at least one chip to an external wiring configurationINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 2, 2006·0 cites·16 claims
- 3236US7034383B2Electronic component and panel and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2003·Granted Apr 25, 2006·0 cites·14 claims
- 3336US2006237855A1Substrate for producing a soldering connection to a second substrateKROEHNERT STEFFEN·Filed 2006·Application pending·0 cites
- 3435US2009194890A1Integrated Circuit and Memory ModuleKAHLISCH KNUT·Filed 2008·Application pending·0 cites
- 3535US2006270109A1Manufacturing method for an electronic component assembly and corresponding electronic component assemblyBLASZCZAK STEPHAN·Filed 2005·Application pending·0 cites
- 3634US2005104227A1Substrate-based package for integrated circuitsFiled 2004·Application pending·0 cites
- 3734US2005098890A1Method for producing an adhesive bond and adhesive bond between a chip and a planar surfaceFiled 2004·Application pending·0 cites
- 3834US2004159928A1Supporting structure for a chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2003·Application pending·0 cites
- 3933US6429537B2Semiconductor component with method for manufacturingINFINEON TECHNOLOGIES AG·Filed 2001·Granted Aug 6, 2002·0 cites·11 claims
- 4033US2005121807A1Arrangement of a chip package constructed on a substrate and substrate for production of the sameFiled 2004·Application pending·0 cites
- 4133US2005051896A1Arrangement for improving module reliabilityFiled 2004·Application pending·0 cites
- 4232US2007221318A1Adhesion tape and method for mounting a chip onto a substrateREISS MARTIN·Filed 2006·Application pending·0 cites
- 4332US2007224729A1Method for manufacturing a flip-chip package, substrate for manufacturing and flip-chip assemblyREISS MARTIN·Filed 2006·Application pending·0 cites
- 4431US2009189292A1Integrated Circuit, Semiconductor Module and Method for Manufacturing a Semiconductor ModuleREISS MARTIN·Filed 2008·Application pending·0 cites
- 4531US2006017149A1Substrate-based BGA package, in particular FBGA packageREISS MARTIN·Filed 2005·Application pending·0 cites
- 4630US2005285247A1Substrate-based die package with BGA or BGA-like componentsREISS MARTIN·Filed 2005·Application pending·0 cites
- 4730US2005285266A1Arrangement for increasing the reliability of substrate-based BGA packagesREISS MARTIN·Filed 2005·Application pending·0 cites
- 4828US2005093175A1Arrangement for improving the reliability of semiconductor modulesFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →