Inventor · disambiguated record
Martin Renkel
Also filed as: RENKEL MARTIN
7 granted patents·5 pending applications·20 citations·filing 2011–2021
80Inventor score
Top patents by PatentIndex Score
12 records- 0190US9828534B2Impact-modified adhesivesHENKEL AG & CO KGAA·Filed 2013·Granted Nov 28, 2017·6 cites·21 claims
- 0286US10066134B2Hybrid matrix for fiber composite materialsHENKEL AG & CO KGAA·Filed 2013·Granted Sep 4, 2018·4 cites·5 claims
- 0384US9790341B2Thermally expandable preparationsHENKEL AG & CO KGAA·Filed 2014·Granted Oct 17, 2017·4 cites·13 claims
- 0477US12163060B2Fast curing epoxy acrylic liquid shimHenkel IP & Holding GmbH·Filed 2021·Granted Dec 10, 2024·1 cites·20 claims
- 0576US8790779B2Adhesive film or adhesive tape based on epoxidesBILCAI EUGEN·Filed 2011·Granted Jul 29, 2014·3 cites·9 claims
- 0663US9464153B2Premix and method for producing a thermally expandable and curable epoxy-based compoundHORNUNG MARTIN·Filed 2012·Granted Oct 11, 2016·1 cites·14 claims
- 0760US9209105B2Electronic devices assembled with thermally insulating layersHenkel IP & Holding GmbH·Filed 2014·Granted Dec 8, 2015·1 cites·20 claims
- 0846US2022056227A1Thermoplastic surfaces comprising direct bonded chemical sealantsHENKEL AG & CO KGAA·Filed 2021·Application pending·0 cites
- 0940US2011297318A1Metal-to-polymer bonding using an adhesive based on epoxidesBARRIAU EMILIE·Filed 2011·Application pending·0 cites
- 1040US2016207252A1Welding method using welding promotersHENKEL AG & CO KGAA·Filed 2016·Application pending·0 cites
- 1139US2012156412A1Use of Low-Temperature Foamable Epoxide Resins in Hollow Chamber StructuresBANKMANN DENNIS·Filed 2012·Application pending·0 cites
- 1234US2011301255A1Epoxide-based structural foam comprising thermoplastic polyurethanesBARRIAU EMILIE·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →