Inventor · disambiguated record
Marites Roque
Also filed as: ROQUE MARITES · ROQUE MARITES LAGUIPO
1 granted patent·4 pending applications·2 citations·filing 2013–2024
19Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0164US9048228B2Integrated circuit packaging system with side solderable leads and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Jun 2, 2015·2 cites·20 claims
- 0254US2025343195A1Semiconductor Devices and Methods of Making and Using Solder Bumps on FO-WLPSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0351US2025219006A1Semiconductor Device and Method of Making a Chip-on-Wafer Underfill BarrierSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0450US2025118643A1Semiconductor Device and Method of Inhibiting Creep of Underfill Material on Back Surface of Semiconductor DieSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0549US2025006608A1Semiconductor Device and Method of Forming Inverted EWLB Package with Vertical E-Bar StructureSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Marites Roque files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →