Inventor · disambiguated record
Mayan Rumbak
Also filed as: RUMBAK MAYAN
9 granted patents·2 pending applications·7 citations·filing 2018–2024
77Inventor score
Files withSTRATASYS LTD11
Top patents by PatentIndex Score
11 records- 0194US11565476B2Apparatus and methods for additive manufacturing of three dimensional objectsSTRATASYS LTD·Filed 2020·Granted Jan 31, 2023·7 cites·11 claims
- 0279US2024149521A1Method and system for additive manufacturing of peelable sacrificial structureSTRATASYS LTD·Filed 2024·Application pending·0 cites
- 0371US12246491B2Apparatus and methods for additive manufacturing of three dimensional objectsSTRATASYS LTD·Filed 2022·Granted Mar 11, 2025·0 cites·11 claims
- 0468US11897187B2Method and system for additive manufacturing of peelable sacrificial structureSTRATASYS LTD·Filed 2020·Granted Feb 13, 2024·0 cites·15 claims
- 0565US11704858B2Method and system for diffusing color error into additive manufactured objectsSTRATASYS LTD·Filed 2022·Granted Jul 18, 2023·0 cites·10 claims
- 0661US12059847B2Method for additive manufacturing an objectSTRATASYS LTD·Filed 2020·Granted Aug 13, 2024·0 cites·20 claims
- 0759US12202921B2Modeling material formulations usable in additive manufacturing of three-dimensional objects at low temperaturesSTRATASYS LTD·Filed 2018·Granted Jan 21, 2025·0 cites·10 claims
- 0854US11417047B2Method and system for diffusing color error into additive manufactured objectsSTRATASYS LTD·Filed 2019·Granted Aug 16, 2022·0 cites·16 claims
- 0950US2024173919A1System and method for high throughput three-dimensional printingSTRATASYS LTD·Filed 2022·Application pending·0 cites
- 1049US12318993B2Method and system for reducing waviness in three-dimensional printingSTRATASYS LTD·Filed 2020·Granted Jun 3, 2025·0 cites·19 claims
- 1148US12157782B2Support material formulations usable in additive manufacturing of three-dimensional objects at low temperaturesSTRATASYS LTD·Filed 2018·Granted Dec 3, 2024·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →