Inventor · disambiguated record
Markus Schieber
Also filed as: SCHIEBER MARKUS
8 granted patents·3 pending applications·3 citations·filing 2011–2024
74Inventor score
Files withSIEMENS AG4BOEHRINGER INGELHEIM VETMEDICA GMBH2RF360 SINGAPORE PTE LTD2FLEISCHER MAXIMILIAN1HEDLER HARRY1
Top patents by PatentIndex Score
11 records- 0171US2024186980A1Wafer level package and method of manufactureRF360 SINGAPORE PTE LTD·Filed 2024·Application pending·0 cites
- 0267US9421500B2Method for producing a microscreenSIEMENS AG·Filed 2014·Granted Aug 23, 2016·2 cites·8 claims
- 0355US9887339B2Infrared sensor, thermal imaging camera and method for producing a microstructure from thermoelectric sensor rodsSIEMENS AG·Filed 2013·Granted Feb 6, 2018·1 cites·14 claims
- 0454US11929729B2Wafer level package and method of manufactureRF360 SINGAPORE PTE LTD·Filed 2019·Granted Mar 12, 2024·0 cites·6 claims
- 0553US9735072B2Method for producing a plurality of measurement regions on a chip, and chip with measurement regionsBOEHRINGER INGELHEIM VETMEDICA GMBH·Filed 2014·Granted Aug 15, 2017·0 cites·13 claims
- 0651US10381277B2Method for producing a plurality of measurement regions on a chip, and chip with measurement regionsBOEHRINGER INGELHEIM VETMEDICA GMBH·Filed 2017·Granted Aug 13, 2019·0 cites·15 claims
- 0749US9442379B2Method for producing a microscreenSIEMENS AG·Filed 2014·Granted Sep 13, 2016·0 cites·2 claims
- 0841US9170226B2Micromechanical substrate for a diaphragm with a diffusion barrier layerFLEISCHER MAXIMILIAN·Filed 2011·Granted Oct 27, 2015·0 cites·10 claims
- 0938US2014084428A1Integrated circuit with electrical through-contact and method for producing electrical through-contactHEDLER HARRY·Filed 2012·Application pending·0 cites
- 1036US2017189882A1Preconcentrator for absorbing/desorbing at least one component of gasSIEMENS AG·Filed 2015·Application pending·0 cites
- 1133US9999120B2Circuit carrier having a conducting path and an electric shieldPOPRAWA FLORIAN·Filed 2012·Granted Jun 12, 2018·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →