Inventor · disambiguated record
Mark R. Schneider
Also filed as: SCHNEIDER MARK · SCHNEIDER MARK R · SCHNEIDER MARK RICHARD
36 granted patents·2,051 citations·filing 1970–2020
98Inventor score
Top patents by PatentIndex Score
36 records- 0197US4077200ACase for an electronic wristwatch moduleFAIRCHILD CAMERA INSTR CO·Filed 1976·Granted Mar 7, 1978·96 cites·5 claims
- 0295US5729894AMethod of assembling ball bump grid array semiconductor packagesLSI LOGIC CORP·Filed 1996·Granted Mar 24, 1998·230 cites·12 claims
- 0395US5311060AHeat sink for semiconductor device assemblyLSI LOGIC CORP·Filed 1992·Granted May 10, 1994·189 cites·26 claims
- 0494US5888847ATechnique for mounting a semiconductor dieLSI LOGIC CORP·Filed 1995·Granted Mar 30, 1999·158 cites·14 claims
- 0593US5728599APrintable superconductive leadframes for semiconductor device assemblyLSI LOGIC CORP·Filed 1995·Granted Mar 17, 1998·155 cites·9 claims
- 0690US5172301AHeatsink for board-mounted semiconductor devices and semiconductor device assembly employing sameLSI LOGIC CORP·Filed 1991·Granted Dec 15, 1992·120 cites·10 claims
- 0789US4229936ALow-cost watch case and bandFAIRCHILD CAMERA INSTR CO·Filed 1977·Granted Oct 28, 1980·50 cites·8 claims
- 0888US5780928AElectronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devicesLSI LOGIC CORP·Filed 1996·Granted Jul 14, 1998·105 cites·21 claims
- 0987US5610442ASemiconductor device package fabrication method and apparatusLSI LOGIC CORP·Filed 1995·Granted Mar 11, 1997·100 cites·26 claims
- 1087US5572069AConductive epoxy grid array semiconductor packagesLSI LOGIC CORP·Filed 1995·Granted Nov 5, 1996·80 cites·9 claims
- 1186US5639696AMicroelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid arrayLSI LOGIC CORP·Filed 1996·Granted Jun 17, 1997·85 cites·10 claims
- 1283US5814536AMethod of manufacturing powdered metal heat sinks having increased surface areaLSI LOGIC CORP·Filed 1995·Granted Sep 29, 1998·66 cites·64 claims
- 1381US5405808AFluid-filled and gas-filled semiconductor packagesLSI LOGIC CORP·Filed 1993·Granted Apr 11, 1995·64 cites·11 claims
- 1481US4167850AElectronic watch apparatusFAIRCHILD CAMERA INSTR CO·Filed 1977·Granted Sep 18, 1979·26 cites·9 claims
- 1576US3947867ATwo part package for a semiconductor dieSIGNETICS CORP·Filed 1970·Granted Mar 30, 1976·30 cites·1 claims
- 1675US5773886ASystem having stackable heat sink structuresLSI LOGIC CORP·Filed 1996·Granted Jun 30, 1998·50 cites·27 claims
- 1775US5744171ASystem for fabricating conductive epoxy grid array semiconductor packagesLSI LOGIC CORP·Filed 1997·Granted Apr 28, 1998·39 cites·8 claims
- 1875US5654587AStackable heatsink structure for semiconductor devicesLSI LOGIC CORP·Filed 1995·Granted Aug 5, 1997·45 cites·30 claims
- 1975US5175612AHeat sink for semiconductor device assemblyLSI LOGIC CORP·Filed 1992·Granted Dec 29, 1992·48 cites·15 claims
- 2069US5410806AMethod for fabricating conductive epoxy grid array semiconductors packagesLSI LOGIC CORP·Filed 1993·Granted May 2, 1995·32 cites·3 claims
- 2168US5789813ABall grid array package with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefromLSI LOGIC CORP·Filed 1996·Granted Aug 4, 1998·31 cites·27 claims
- 2265US5869891APowdered metal heat sink with increased surface areaLSI LOGIC CORP·Filed 1997·Granted Feb 9, 1999·27 cites·55 claims
- 2363US5514327APowder metal heat sink for integrated circuit devicesLSI LOGIC CORP·Filed 1993·Granted May 7, 1996·26 cites·10 claims
- 2462US5900670AStackable heatsink structures for semiconductor devicesLSI LOGIC CORP·Filed 1997·Granted May 4, 1999·25 cites·54 claims
- 2561US5051813APlastic-packaged semiconductor device having lead support and alignment structureLSI LOGIC CORP·Filed 1990·Granted Sep 24, 1991·31 cites·4 claims
- 2658US5693981AElectronic system with heat dissipating apparatus and method of dissipating heat in an electronic systemLSI LOGIC CORP·Filed 1995·Granted Dec 2, 1997·22 cites·16 claims
- 2757US5593918ATechniques for forming superconductive linesLSI LOGIC CORP·Filed 1994·Granted Jan 14, 1997·20 cites·4 claims
- 2855US5963795AMethod of assembling a heat sink assemblyLSI LOGIC CORP·Filed 1996·Granted Oct 5, 1999·18 cites·26 claims
- 2953US5504374AMicrocircuit package assembly utilizing large size die and low temperature curing organic die attach materialLSI LOGIC CORP·Filed 1994·Granted Apr 2, 1996·27 cites·19 claims
- 3051US5552634AMethod and apparatus for dissipating heat in an electronic deviceLSI LOGIC CORP·Filed 1993·Granted Sep 3, 1996·18 cites·26 claims
- 3142US4182020AMethod of manufacturing a battery cover for placement in an opening in a battery containerFAIRCHILD CAMERA INSTR CO·Filed 1978·Granted Jan 8, 1980·10 cites·3 claims
- 3240US5869778APowder metal heat sink for integrated circuit devicesLSI LOGIC CORP·Filed 1997·Granted Feb 9, 1999·7 cites·27 claims
- 3339US5885848ABall grid array with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefromLSI LOGIC CORP·Filed 1997·Granted Mar 23, 1999·7 cites·20 claims
- 3438US5644143AMethod for protecting a semiconductor device with a superconductive lineLSI LOGIC CORP·Filed 1995·Granted Jul 1, 1997·6 cites·7 claims
- 3536US5104827AMethod of making a plastic-packaged semiconductor device having lead support and alignment structureLSI LOGIC CORP·Filed 1991·Granted Apr 14, 1992·8 cites·3 claims
- 3629US11049524B1Interrelated entertainment devices for music and related informationSCHNEIDER KAREN·Filed 2020·Granted Jun 29, 2021·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →