Inventor · disambiguated record
Matt E. Schwab
Also filed as: SCHWAB MATT · SCHWAB MATT E
40 granted patents·2 pending applications·264 citations·filing 2000–2019
98Inventor score
Top patents by PatentIndex Score
42 records- 0198US9362208B2Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor componentsMICRON TECHNOLOGY INC·Filed 2015·Granted Jun 7, 2016·19 cites·22 claims
- 0294US6668449B2Method of making a semiconductor device having an opening in a solder maskMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 30, 2003·63 cites·26 claims
- 0389US7084514B2Multi-chip module and methodsMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 1, 2006·13 cites·22 claims
- 0487US8354301B2Packaged microdevices and methods for manufacturing packaged microdevicesMICRON TECHNOLOGY INC·Filed 2011·Granted Jan 15, 2013·7 cites·23 claims
- 0586US7868440B2Packaged microdevices and methods for manufacturing packaged microdevicesMICRON TECHNOLOGY INC·Filed 2006·Granted Jan 11, 2011·11 cites·13 claims
- 0685US7750449B2Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor componentsMICRON TECHNOLOGY INC·Filed 2007·Granted Jul 6, 2010·8 cites·15 claims
- 0785US6867500B2Multi-chip module and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 15, 2005·29 cites·69 claims
- 0882US9960094B2Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor componentsMICRON TECHNOLOGY INC·Filed 2016·Granted May 1, 2018·2 cites·11 claims
- 0982US7619313B2Multi-chip module and methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 17, 2009·7 cites·18 claims
- 1079US7851922B2Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devicesROUND ROCK RES LLC·Filed 2008·Granted Dec 14, 2010·5 cites·16 claims
- 1176US7423336B2Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 9, 2008·14 cites·34 claims
- 1275US6882034B2Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 19, 2005·15 cites·87 claims
- 1371US6987325B2Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting elementMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 17, 2006·10 cites·22 claims
- 1470US7146720B2Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducialMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 12, 2006·10 cites·18 claims
- 1569US7282805B2Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting elementMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 16, 2007·2 cites·15 claims
- 1669US7282397B2Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 16, 2007·2 cites·23 claims
- 1768US8048715B2Multi-chip module and methodsROUND ROCK RES LLC·Filed 2009·Granted Nov 1, 2011·2 cites·20 claims
- 1868US7955898B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2007·Granted Jun 7, 2011·2 cites·12 claims
- 1966US8735183B2System in package (SIP) with dual laminate interposersCORISIS DAVID J·Filed 2007·Granted May 27, 2014·1 cites·16 claims
- 2065US7944057B2Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devicesROUND ROCK RES LLC·Filed 2009·Granted May 17, 2011·1 cites·20 claims
- 2164US6995043B2Methods for fabricating routing elements for multichip modulesMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 7, 2006·8 cites·22 claims
- 2263US10763185B2Packaged semiconductor components having substantially rigid support membersMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 1, 2020·0 cites·11 claims
- 2362US10692827B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 23, 2020·0 cites·9 claims
- 2462US7372131B2Routing element for use in semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2005·Granted May 13, 2008·1 cites·11 claims
- 2561US10312173B2Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor componentsMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 4, 2019·0 cites·10 claims
- 2660US10297574B2System in package (SIP) with dual laminate interposersMICRON TECHNOLOGY INC·Filed 2014·Granted May 21, 2019·0 cites·19 claims
- 2760US7335571B2Method of making a semiconductor device having an opening in a solder maskMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 26, 2008·5 cites·54 claims
- 2860US7095097B2Integrated circuit device having reduced bow and method for making sameMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 22, 2006·6 cites·26 claims
- 2960US2019237436A1System in package (sip) with dual laminate interposersMICRON TECHNOLOGY INC·Filed 2019·Application pending·0 cites
- 3059US10163826B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 25, 2018·0 cites·9 claims
- 3159US9812415B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2014·Granted Nov 7, 2017·0 cites·8 claims
- 3259US7019223B2Solder resist opening to define a combination pin one indicator and fiducialMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 28, 2006·5 cites·22 claims
- 3359US7013559B2Method of fabricating a semiconductor device packageMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 21, 2006·5 cites·27 claims
- 3458US7094631B2Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 22, 2006·4 cites·21 claims
- 3555US8987885B2Packaged microdevices and methods for manufacturing packaged microdevicesMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 24, 2015·0 cites·9 claims
- 3655US6887740B2Method for making an integrated circuit package having reduced bowMICRON TECHNOLOGY INC·Filed 2003·Granted May 3, 2005·4 cites·21 claims
- 3752US6577018B1Integrated circuit device having reduced bow and method for making sameMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·3 cites·33 claims
- 3851US2010255636A1Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor componentsMICRON TECHNOLOGY INC·Filed 2010·Application pending·0 cites
- 3950US7344921B2Integrated circuit device having reduced bow and method for making sameMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 18, 2008·0 cites·20 claims
- 4049US7372138B2Routing element for use in multi-chip modules, multi-chip modules including the routing element and methodsMICRON TECHNOLOGY INC·Filed 2005·Granted May 13, 2008·0 cites·12 claims
- 4146US8866272B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesSCHWAB MATT E·Filed 2011·Granted Oct 21, 2014·0 cites·12 claims
- 4244US7263768B2Method of making a semiconductor device having an opening in a solder maskMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 4, 2007·0 cites·52 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →