Inventor · disambiguated record
Masanori Segawa
Also filed as: SEGAWA MASANORI
36 granted patents·2 pending applications·1,079 citations·filing 1989–2016
98Inventor score
Top patents by PatentIndex Score
38 records- 0198US5068712ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Nov 26, 1991·165 cites·36 claims
- 0294US6028364ASemiconductor device having a stress relieving mechanismHITACHI LTD·Filed 1995·Granted Feb 22, 2000·167 cites·19 claims
- 0389US6114005ALaminate and multilayer printed circuit boardHITACHI LTD·Filed 1997·Granted Sep 5, 2000·98 cites·19 claims
- 0488US6114753ACircuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 1997·Granted Sep 5, 2000·50 cites·23 claims
- 0588US5677045ALaminate and multilayer printed circuit boardHITACHI LTD·Filed 1995·Granted Oct 14, 1997·86 cites·8 claims
- 0686US5530286ASemiconductor deviceHITACHI LTD·Filed 1994·Granted Jun 25, 1996·53 cites·6 claims
- 0784US5358904ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Oct 25, 1994·47 cites·15 claims
- 0883US6423571B2Method of making a semiconductor device having a stress relieving mechanismHITACHI LTD·Filed 2001·Granted Jul 23, 2002·35 cites·19 claims
- 0980US6326681B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Dec 4, 2001·14 cites·14 claims
- 1080US5793099ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Aug 11, 1998·30 cites·12 claims
- 1179US6081023ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Jun 27, 2000·28 cites·13 claims
- 1278US5612569ASemiconductor deviceHITACHI LTD·Filed 1995·Granted Mar 18, 1997·35 cites·9 claims
- 1377US6097100AResin sealed semiconductor devices and a process for manufacturing the sameHITACHI LTD·Filed 1997·Granted Aug 1, 2000·56 cites·16 claims
- 1474US6303982B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Oct 16, 2001·10 cites·28 claims
- 1571US6791194B1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 14, 2004·18 cites·18 claims
- 1669US6130114ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Oct 10, 2000·17 cites·22 claims
- 1769US6018191ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 25, 2000·18 cites·23 claims
- 1867US6531760B1Semiconductor deviceFiled 2000·Granted Mar 11, 2003·6 cites·8 claims
- 1967US5914530ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 22, 1999·15 cites·12 claims
- 2065US6433440B1Semiconductor device having a porous buffer layer for semiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 13, 2002·24 cites·19 claims
- 2163US6100580ASemiconductor device having all outer leads extending from one side of a resin memberHITACHI LTD·Filed 1998·Granted Aug 8, 2000·17 cites·19 claims
- 2263US6069029ASemiconductor device chip on lead and lead on chip manufacturingHITACHI LTD·Filed 1998·Granted May 30, 2000·13 cites·36 claims
- 2361US7202570B2Circuit tape having adhesive film semiconductor device and a method for manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Apr 10, 2007·6 cites·23 claims
- 2461US6072231ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 6, 2000·12 cites·40 claims
- 2553US6720208B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Apr 13, 2004·2 cites·13 claims
- 2651US7038325B2Wiring tape for semiconductor device including a buffer layer having interconnected foamsRENESAS TECH CORP·Filed 2004·Granted May 2, 2006·3 cites·9 claims
- 2751US5981315ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Nov 9, 1999·7 cites·37 claims
- 2851US5821606ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Oct 13, 1998·9 cites·45 claims
- 2950US11453372B2Brake apparatus, brake control method, and method for determining lock abnormality in motorHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2016·Granted Sep 27, 2022·0 cites·17 claims
- 3050US5863817ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 26, 1999·7 cites·23 claims
- 3150US5181097APlastic molded type electronic deviceHITACHI LTD·Filed 1990·Granted Jan 19, 1993·19 cites·9 claims
- 3244US6919622B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Jul 19, 2005·0 cites·6 claims
- 3341US6204552B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Mar 20, 2001·0 cites·15 claims
- 3440US2002160185A1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameFiled 2002·Application pending·0 cites
- 3540US2002158343A1Semiconductor device and wiring tape for semiconductor deviceFiled 2002·Application pending·0 cites
- 3637US6124629ASemiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chipHITACHI LTD·Filed 1998·Granted Sep 26, 2000·3 cites·9 claims
- 3737US5225499AResin composition for encapsulating of semiconductor and semiconductor apparatus using of the sameHITACHI LTD·Filed 1991·Granted Jul 6, 1993·8 cites·7 claims
- 3832US6100115ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 8, 2000·1 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when Masanori Segawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →