Inventor · disambiguated record
Ma. Fatima Seijo
Also filed as: SEIJO MA FATIMA
11 granted patents·1 pending application·397 citations·filing 2000–2015
93Inventor score
Technology areasH10P
Top patents by PatentIndex Score
12 records- 0196US6773873B2pH buffered compositions useful for cleaning residue from semiconductor substratesADVANCED TECH MATERIALS·Filed 2002·Granted Aug 10, 2004·115 cites·14 claims
- 0295US6896826B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2001·Granted May 24, 2005·74 cites·49 claims
- 0391US6344432B1Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structuresADVANCED TECH MATERIALS·Filed 2000·Granted Feb 5, 2002·51 cites·14 claims
- 0490US6755989B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2001·Granted Jun 29, 2004·43 cites·12 claims
- 0589US7605113B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2005·Granted Oct 20, 2009·11 cites·22 claims
- 0686US6566315B2Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structuresADVANCED TECH MATERIALS·Filed 2001·Granted May 20, 2003·50 cites·28 claims
- 0779US7534752B2Post plasma ashing wafer cleaning formulationADVANCED TECH MATERIALS·Filed 2001·Granted May 19, 2009·23 cites·34 claims
- 0878US6967169B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2004·Granted Nov 22, 2005·16 cites·13 claims
- 0976US7662762B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substratesADVANCED TECH MATERIALS·Filed 2005·Granted Feb 16, 2010·4 cites·20 claims
- 1063US6660700B2Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structuresADVANCED TECHNOLOGIES MATERIAL·Filed 2001·Granted Dec 9, 2003·10 cites·14 claims
- 1156US9109188B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2012·Granted Aug 18, 2015·0 cites·13 claims
- 1255US2015344826A1Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →