Inventor · disambiguated record
Masaru Seita
Also filed as: SEITA MASARU
5 granted patents·7 pending applications·114 citations·filing 1992–2005
82Inventor score
Top patents by PatentIndex Score
12 records- 0188US6881319B2Electrolytic copper plating solution and method for controlling the sameSHIPLEY CO LLC·Filed 2001·Granted Apr 19, 2005·27 cites·13 claims
- 0286US5454930AElectrolytic copper plating using a reducing agentLEARONAL JAPAN INC·Filed 1994·Granted Oct 3, 1995·41 cites·3 claims
- 0373US6740425B2Method for manufacturing copper-resin composite materialSHIPLEY CO LLC·Filed 2002·Granted May 25, 2004·15 cites·12 claims
- 0466US6899781B2Method for forming resin composite materialSHIPLEY CO LLC·Filed 2002·Granted May 31, 2005·6 cites·13 claims
- 0563US5302256AImmersion tin/lead alloy plating bathLEARONAL JAPAN INC·Filed 1992·Granted Apr 12, 1994·25 cites·11 claims
- 0646US2005164020A1Composite material with improved binding strength and method for forming the sameSHIPLEY CO LLC·Filed 2005·Application pending·0 cites
- 0743US2003155247A1Process for electroplating silicon wafersSHIPLEY CO LLC·Filed 2002·Application pending·0 cites
- 0840US2004101665A1Direct patterning methodSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 0939US2004050706A1Copper electroplating method using insoluble anodeFiled 2001·Application pending·0 cites
- 1038US2004072015A1Composite material with improved binding strength and method for forming the sameSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 1136US2004170846A1Resin composite material and method of forming the sameFiled 2001·Application pending·0 cites
- 1235US2004253450A1Formaldehyde-free electroless copper plating process and solution for use in the processSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →