Inventor · disambiguated record
Makoto Senoo
Also filed as: SENOO MAKOTO
28 granted patents·78 citations·filing 2003–2022
94Inventor score
Files withWINBOND ELECTRONICS CORP24HITACHI LTD1NISHIMIZU AKIRA1SAMSUNG ELECTRONICS CO LTD1SENOO MAKOTO1
Top patents by PatentIndex Score
28 records- 0188US10304543B2Semiconductor memory device for improving high temperature data retentionWINBOND ELECTRONICS CORP·Filed 2017·Granted May 28, 2019·7 cites·7 claims
- 0285US7593266B2Semiconductor memory device and method of verifying the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 22, 2009·20 cites·8 claims
- 0384US11735270B2Semiconductor device and continuous reading methodWINBOND ELECTRONICS CORP·Filed 2020·Granted Aug 22, 2023·2 cites·20 claims
- 0484US9064580B2Nonvolatile semiconductor memory device and write-in method thereofSENOO MAKOTO·Filed 2012·Granted Jun 23, 2015·11 cites·17 claims
- 0581US6957583B2Ultrasonic array sensor, ultrasonic inspection instrument and ultrasonic inspection methodHITACHI LTD·Filed 2003·Granted Oct 25, 2005·24 cites·20 claims
- 0679US11488644B2Semiconductor device and reading methodWINBOND ELECTRONICS CORP·Filed 2021·Granted Nov 1, 2022·1 cites·12 claims
- 0773US10096369B2Semiconductor device including a voltage generation circuit, and voltage generation circuit generates a required voltage according to internal data requested in response to an operationWINBOND ELECTRONICS CORP·Filed 2017·Granted Oct 9, 2018·3 cites·13 claims
- 0867US10297295B2Semiconductor memory deviceWINBOND ELECTRONICS CORP·Filed 2017·Granted May 21, 2019·2 cites·12 claims
- 0967US8228058B2Eddy current flaw detection probeNISHIMIZU AKIRA·Filed 2008·Granted Jul 24, 2012·3 cites·3 claims
- 1066US10032512B2Non-volatile semiconductor memory deviceWINBOND ELECTRONICS CORP·Filed 2017·Granted Jul 24, 2018·2 cites·11 claims
- 1164US10643712B2Semiconductor memory device for improving high temperature data retentionWINBOND ELECTRONICS CORP·Filed 2019·Granted May 5, 2020·1 cites·8 claims
- 1261US12067283B2Memory apparatus and memory testing method thereof for correcting ROM code having error by ECC processing unit after determined to transition to safe modeWINBOND ELECTRONICS CORP·Filed 2022·Granted Aug 20, 2024·0 cites·18 claims
- 1361US10665304B2Semiconductor memory device and methods for operating a semiconductor memory deviceWINBOND ELECTRONICS CORP·Filed 2018·Granted May 26, 2020·1 cites·12 claims
- 1458US11775205B2Semiconductor storage device and reading methodWINBOND ELECTRONICS CORP·Filed 2022·Granted Oct 3, 2023·0 cites·13 claims
- 1558US11487614B2Semiconductor storing apparatus and readout methodWINBOND ELECTRONICS CORP·Filed 2021·Granted Nov 1, 2022·0 cites·14 claims
- 1658US10641825B2Semiconductor storage device, operating method thereof and analysis systemWINBOND ELECTRONICS CORP·Filed 2018·Granted May 5, 2020·0 cites·17 claims
- 1756US11961568B2Semiconductor device and reading methodWINBOND ELECTRONICS CORP·Filed 2022·Granted Apr 16, 2024·0 cites·15 claims
- 1855US11990188B2Semiconductor apparatus and continuous readout methodWINBOND ELECTRONICS CORP·Filed 2021·Granted May 21, 2024·0 cites·15 claims
- 1955US11315640B2Semiconductor device and continuous reading methodWINBOND ELECTRONICS CORP·Filed 2020·Granted Apr 26, 2022·0 cites·10 claims
- 2054US11775441B2Semiconductor apparatus and readout methodWINBOND ELECTRONICS CORP·Filed 2021·Granted Oct 3, 2023·0 cites·13 claims
- 2153US9613703B2Semiconductor memory deviceWINBOND ELECTRONICS CORP·Filed 2014·Granted Apr 4, 2017·1 cites·9 claims
- 2251US11423998B2Semiconductor device and reading method thereofWINBOND ELECTRONICS CORP·Filed 2021·Granted Aug 23, 2022·0 cites·20 claims
- 2350US11495297B2Semiconductor device and reading method thereofWINBOND ELECTRONICS CORP·Filed 2021·Granted Nov 8, 2022·0 cites·18 claims
- 2446US11972827B2Semiconductor storage device and reading methodWINBOND ELECTRONICS CORP·Filed 2022·Granted Apr 30, 2024·0 cites·15 claims
- 2545US12051480B2Semiconductor storage deviceWINBOND ELECTRONICS CORP·Filed 2022·Granted Jul 30, 2024·0 cites·14 claims
- 2643US10510421B2Semiconductor storage device and readout method thereofWINBOND ELECTRONICS CORP·Filed 2018·Granted Dec 17, 2019·0 cites·13 claims
- 2741US9214241B2Semiconductor memory device and erasing methodWINBOND ELECTRONICS CORP·Filed 2014·Granted Dec 15, 2015·0 cites·8 claims
- 2837US10817189B2Semiconductor memory device and operation setting method thereofWINBOND ELECTRONICS CORP·Filed 2017·Granted Oct 27, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →