Inventor · disambiguated record
Masayuki Serikawa
Also filed as: SERIKAWA MASAYUKI
1 granted patent·5 pending applications·0 citations·filing 2012–2025
10Inventor score
Files withFUJIMI INC6
Top patents by PatentIndex Score
6 records- 0153US2025263584A1Polishing composition and polishing methodFUJIMI INC·Filed 2025·Application pending·0 cites
- 0235US2015166839A1Polishing composition and substrate fabrication method using sameFUJIMI INC·Filed 2013·Application pending·0 cites
- 0335US2014302753A1Polishing compositionFUJIMI INC·Filed 2012·Application pending·0 cites
- 0428US9796881B2Polishing composition and method using said polishing composition to manufacture compound semiconductor substrateFUJIMI INC·Filed 2013·Granted Oct 24, 2017·0 cites·11 claims
- 0526US2018022960A1Polishing composition, polishing method, and method for manufacturing hard brittle material substrateFUJIMI INC·Filed 2016·Application pending·0 cites
- 0622US2015290760A1Polishing compositionFUJIMI INC·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Masayuki Serikawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →