Inventor · disambiguated record
Mahesh K. Shah
Also filed as: SHAH MAHESH · SHAH MAHESH K
24 granted patents·1 pending application·321 citations·filing 1994–2019
96Inventor score
Files withFREESCALE SEMICONDUCTOR INC10NXP USA INC8MOTOROLA INC4VISWANATHAN LAKSHMINARAYAN2CONDIE BRIAN W1
Top patents by PatentIndex Score
25 records- 0197US10269678B1Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereofNXP USA INC·Filed 2017·Granted Apr 23, 2019·31 cites·16 claims
- 0295US9450547B2Semiconductor package having an isolation wall to reduce electromagnetic couplingFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Sep 20, 2016·18 cites·33 claims
- 0394US10440813B1Microelectronic modules including thermal extension levels and methods for the fabrication thereofNXP USA INC·Filed 2018·Granted Oct 8, 2019·8 cites·16 claims
- 0490US9673162B2High power semiconductor package subsystemsVISWANATHAN LAKSHMINARAYAN·Filed 2012·Granted Jun 6, 2017·11 cites·10 claims
- 0590US9607953B1Semiconductor package with isolation wallFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Mar 28, 2017·17 cites·20 claims
- 0690US5888412AMethod for making a sculptured diaphragmMOTOROLA INC·Filed 1996·Granted Mar 30, 1999·79 cites·15 claims
- 0786US9538659B2Solder wettable flanges and devices and systems incorporating solder wettable flangesVISWANATHAN LAKSHMINARAYAN·Filed 2013·Granted Jan 3, 2017·6 cites·20 claims
- 0885US7435625B2Semiconductor device with reduced package cross-talk and lossFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Oct 14, 2008·14 cites·12 claims
- 0983US5918112ASemiconductor component and method of fabricationMOTOROLA INC·Filed 1997·Granted Jun 29, 1999·53 cites·6 claims
- 1080US10405417B2Packaged microelectronic component mounting using sinter attachmentNXP USA INC·Filed 2017·Granted Sep 3, 2019·2 cites·15 claims
- 1178US10861764B2Microelectronic components having integrated heat dissipation posts and systems including the sameNXP USA INC·Filed 2019·Granted Dec 8, 2020·2 cites·20 claims
- 1277US5581226AHigh pressure sensor structure and methodMOTOROLA INC·Filed 1994·Granted Dec 3, 1996·58 cites·19 claims
- 1376US9300254B2Radio frequency devices with surface-mountable capacitors for decoupling and methods thereofFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Mar 29, 2016·3 cites·17 claims
- 1471US10110170B2Semiconductor package having an isolation wall to reduce electromagnetic couplingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Oct 23, 2018·1 cites·14 claims
- 1570US7701074B2Semiconductor device with a buffer region with tightly-packed filler particlesFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Apr 20, 2010·4 cites·18 claims
- 1670US7332414B2Chemical die singulation techniqueFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Feb 19, 2008·3 cites·19 claims
- 1769US10211177B2High power semiconductor package subsystemsNXP USA INC·Filed 2017·Granted Feb 19, 2019·1 cites·10 claims
- 1861US10806021B2Packaged microelectronic component mounting using sinter attachmentNXP USA INC·Filed 2019·Granted Oct 13, 2020·0 cites·7 claims
- 1961US9484222B2Semiconductor devices, semiconductor device packages, and packaging techniques for impedance matching and/or low frequency terminationsFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Nov 1, 2016·1 cites·19 claims
- 2061US7432133B2Plastic packaged device with die interface layerFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Oct 7, 2008·2 cites·8 claims
- 2160US10630243B2Semiconductor package having an isolation wall to reduce electromagnetic couplingNXP USA INC·Filed 2019·Granted Apr 21, 2020·0 cites·20 claims
- 2260US10476442B2Semiconductor package having an isolation wall to reduce electromagnetic couplingNXP USA INC·Filed 2018·Granted Nov 12, 2019·0 cites·14 claims
- 2351US9800208B2Radio frequency devices with surface-mountable capacitors for decoupling and methods thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Oct 24, 2017·0 cites·18 claims
- 2440US2007090545A1Semiconductor device with improved encapsulationCONDIE BRIAN W·Filed 2005·Application pending·0 cites
- 2533US5528069ASensing transducer using a Schottky junction and having an increased output signal voltageMOTOROLA INC·Filed 1995·Granted Jun 18, 1996·7 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →