Inventor · disambiguated record
Makoto Shibuya
Also filed as: SHIBUYA MAKOTO
61 granted patents·42 pending applications·739 citations·filing 1990–2025
98Inventor score
Files withTEXAS INSTRUMENTS INC53SHIBUYA MAKOTO9MATSUSHITA ELECTRIC INDUSTRIAL CO LTD8SAMSUNG ELECTRONICS CO LTD7ROHM CO LTD4
Top patents by PatentIndex Score
103 records- 0196US9620440B1Power module packaging with dual side coolingTEXAS INSTRUMENTS INC·Filed 2016·Granted Apr 11, 2017·21 cites·11 claims
- 0291US11656021B2RefrigeratorSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 23, 2023·3 cites·18 claims
- 0389US6274859B1High frequency heating apparatus for selective heating of a desired portion of an objectMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Aug 14, 2001·90 cites·15 claims
- 0489US6172348B1High frequency heating apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Jan 9, 2001·77 cites·14 claims
- 0589US6137095ACooking device with system for controlling cooking of foodsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 24, 2000·91 cites·31 claims
- 0689US5986249AHigh frequency heating apparatus for providing a uniform heating of an objectMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Nov 16, 1999·81 cites·21 claims
- 0787US11088055B2Package with dies mounted on opposing surfaces of a leadframeTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 10, 2021·4 cites·16 claims
- 0886US11387179B2IC package with half-bridge power moduleTEXAS INSTRUMENTS INC·Filed 2020·Granted Jul 12, 2022·2 cites·20 claims
- 0986US10132555B2RefrigeratorSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 20, 2018·8 cites·15 claims
- 1085US6564576B2Motor-driven compressorsSANDEN CORP·Filed 2001·Granted May 20, 2003·32 cites·6 claims
- 1184US12230539B2Wafer chip scale packaging with ball attach before repassivationTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 18, 2025·4 cites·4 claims
- 1284US11062980B2Integrated circuit packages with wettable flanks and methods of manufacturing the sameTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 13, 2021·4 cites·13 claims
- 1384US10541220B1Printed repassivation for wafer chip scale packagingTEXAS INSTRUMENTS INC·Filed 2018·Granted Jan 21, 2020·4 cites·26 claims
- 1484US8593099B2Electric compressorSHIBUYA MAKOTO·Filed 2009·Granted Nov 26, 2013·9 cites·4 claims
- 1583US6371925B1Radiation clinical thermometerMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Apr 16, 2002·113 cites·30 claims
- 1682US9236317B2Semiconductor deviceROHM CO LTD·Filed 2014·Granted Jan 12, 2016·5 cites·63 claims
- 1782US8038517B2Air conditioner and method for assembling the sameFUJITSU GENERAL LTD·Filed 2006·Granted Oct 18, 2011·18 cites·8 claims
- 1879US8631664B2Air conditioner with automatic air filter cleanerSHIBUYA MAKOTO·Filed 2009·Granted Jan 21, 2014·12 cites·5 claims
- 1978US10935300B2Refrigerator including a detachably mounted cooling unitSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 2, 2021·2 cites·19 claims
- 2078US8282695B2Air conditionerSHIBUYA MAKOTO·Filed 2009·Granted Oct 9, 2012·8 cites·4 claims
- 2178US7352598B2Inverter units with duty cycle control based on the detected, high and low output voltageSANDEN CORP·Filed 2006·Granted Apr 1, 2008·6 cites·4 claims
- 2277US8813518B2Air conditionerSUGIYAMA SHINJI·Filed 2010·Granted Aug 26, 2014·4 cites·8 claims
- 2377US6710564B2Methods and apparatus for controlling brushless motorsSANDEN CORP·Filed 2002·Granted Mar 23, 2004·31 cites·16 claims
- 2475US10414298B2Vehicle seatTS TECH CO LTD·Filed 2017·Granted Sep 17, 2019·4 cites·12 claims
- 2575US2024379509A1Heat-dissipating wirebonded members on package surfacesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2674US8698364B2Inverter-integrated electric compressorSAITO ATSUSHI·Filed 2009·Granted Apr 15, 2014·7 cites·7 claims
- 2771US12456707B2Stacked clip design for GaN half bridge IPMTEXAS INSTRUMENTS INC·Filed 2022·Granted Oct 28, 2025·0 cites·19 claims
- 2869US12272626B2Conductive members atop semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2022·Granted Apr 8, 2025·0 cites·18 claims
- 2969US10077186B2Integrated circuit package with sensor and method of makingTEXAS INSTRUMENTS INC·Filed 2017·Granted Sep 18, 2018·1 cites·19 claims
- 3069US5250775AElectric cooking apparatus adapted for generating high power output containing a batteryMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Oct 5, 1993·39 cites·11 claims
- 3168US11764142B2Semiconductor apparatus and method having a lead frame with floating leadsTEXAS INSTRUMENTS INC·Filed 2022·Granted Sep 19, 2023·0 cites·28 claims
- 3268US10566269B2Low stress integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2017·Granted Feb 18, 2020·1 cites·18 claims
- 3368US2025201677A1Conductive members atop semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 3467US11842952B2Double side heat dissipation for silicon chip packageTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 12, 2023·0 cites·8 claims
- 3567US11574855B2Package with dies mounted on opposing surfaces of a leadframeTEXAS INSTRUMENTS INC·Filed 2021·Granted Feb 7, 2023·0 cites·10 claims
- 3667US2023198422A1Power converter moduleTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3766US12046542B2Heat-dissipating wirebonded members on package surfacesTEXAS INSTRUMENTS INC·Filed 2021·Granted Jul 23, 2024·0 cites·15 claims
- 3866US8653778B2Inverter-integrated electric compressorSAITO ATSUSHI·Filed 2010·Granted Feb 18, 2014·1 cites·5 claims
- 3965US11601065B1Power converter moduleTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 4065US11217513B2Integrated circuit package with pre-wetted contact sidewall surfacesTEXAS INSTRUMENTS INC·Filed 2020·Granted Jan 4, 2022·0 cites·17 claims
- 4165US9688530B2Integrated circuit package with sensor and method of makingTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 27, 2017·1 cites·12 claims
- 4265US2025107956A1Massage machineSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4364US8024018B2Electronic apparatusFUJITSU TOSHIBA MOBILE COMM·Filed 2008·Granted Sep 20, 2011·1 cites·10 claims
- 4463US12119263B2Methods and apparatus for an improved integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 15, 2024·0 cites·16 claims
- 4559US5288961AHigh frequency heating apparatus utilizing an inverter power supplyMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Feb 22, 1994·20 cites·13 claims
- 4659US2025079268A1Dual package switching power deviceTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 4758US11942384B2Semiconductor package having an interdigitated mold arrangementTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 26, 2024·0 cites·22 claims
- 4858US11217522B2Semiconductor apparatus and method having a lead frame with floating leadsTEXAS INSTRUMENTS INC·Filed 2019·Granted Jan 4, 2022·0 cites·20 claims
- 4958US2025070101A1Dual switching power deviceTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 5057US11848244B2Leaded wafer chip scale packagesTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 19, 2023·0 cites·23 claims
Showing the top 50 of 103 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →