Inventor · disambiguated record
Masahiro Shimamura
Also filed as: SHIMAMURA MASAHIRO
5 granted patents·7 pending applications·29 citations·filing 1986–2023
69Inventor score
Files withTOYO SEIKAN GROUP HOLDINGS LTD8TOYO SEIKAN GROUP HOLDONGS LTD2KOBE STEEL LTD1SHIMAMURA MASAHIRO1
Top patents by PatentIndex Score
12 records- 0178US2023286032A1Machining jig, machining method, and method of manufacturing seamless can bodiesTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2023·Application pending·0 cites
- 0277US4806307AAluminum alloy with superior thermal neutron absorptivityKOBE STEEL LTD·Filed 1986·Granted Feb 21, 1989·29 cites·3 claims
- 0369US12343778B2Die for ironing working and die moduleTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2020·Granted Jul 1, 2025·0 cites·2 claims
- 0469US12036597B2Jig for metal plastic workingTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2019·Granted Jul 16, 2024·0 cites·4 claims
- 0568US2021354191A1Machining jig, machining method, and method of manufacturing seamless can bodiesTOYO SEIKAN GROUP HOLDONGS LTD·Filed 2019·Application pending·0 cites
- 0660US11745245B2Metallic worked articlesTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2019·Granted Sep 5, 2023·0 cites·2 claims
- 0757US2018229287A1Die for ironing working and die moduleTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2016·Application pending·0 cites
- 0854US10155293B2Diamond surface polishing method and apparatus for implementing sameTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2017·Granted Dec 18, 2018·0 cites·19 claims
- 0954US2023119966A1Method for manufacturing bottomed cylindrical bodyTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2021·Application pending·0 cites
- 1052US2021394248A1Pressing die and press working methodTOYO SEIKAN GROUP HOLDONGS LTD·Filed 2019·Application pending·0 cites
- 1149US2023122197A1Method for manufacturing bottomed cylindrical bodyTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2021·Application pending·0 cites
- 1238US2009165262A1Junctional structure and junction means of various buckle members for wearingSHIMAMURA MASAHIRO·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →