Inventor · disambiguated record
Masayuki Shimura
Also filed as: SHIMURA MASAYUKI
15 granted patents·8 pending applications·212 citations·filing 1991–2023
92Inventor score
Files withTAIYO INK MFG CO LTD12SHINKAWA KK3TAIYO HOLDINGS CO LTD3FUJI HEAVY IND LTD1JIDOSHA KIKI CO1
Top patents by PatentIndex Score
23 records- 0190US10005911B2Curable composition for printed wiring board, and cured coating and printed wiring board using sameTAIYO INK MFG CO LTD·Filed 2014·Granted Jun 26, 2018·7 cites·20 claims
- 0286US11535766B2Curable composition for inkjet printing, cured product of same, and electronic component having the cured productTAIYO INK MFG CO LTD·Filed 2019·Granted Dec 27, 2022·2 cites·20 claims
- 0382US9797298B2Engine air intake structureFUJI HEAVY IND LTD·Filed 2016·Granted Oct 24, 2017·3 cites·4 claims
- 0477US5150021AMethod of controlling electric power steering apparatusJIDOSHA KIKI CO·Filed 1992·Granted Sep 22, 1992·40 cites·2 claims
- 0575US9182665B2White curable composition for printed circuit board, cured coating film using the same, and printed circuit boardTAIYO INK MFG CO LTD·Filed 2014·Granted Nov 10, 2015·2 cites·20 claims
- 0675US5432468AClock generator circuit for use in a personal computer systemNEC CORP·Filed 1994·Granted Jul 11, 1995·75 cites·8 claims
- 0774US6307393B1Device for detecting defects in solid-state image sensorSONY CORP·Filed 1997·Granted Oct 23, 2001·55 cites·8 claims
- 0866US10113066B2Curable composition, cured coating film using same, and printed wiring boardTAIYO INK MFG CO LTD·Filed 2014·Granted Oct 30, 2018·1 cites·20 claims
- 0965US2025289975A1Cured product and printed wiring boardTAIYO HOLDINGS CO LTD·Filed 2023·Application pending·0 cites
- 1064US9453137B2Photo-curable/thermally curable composition, method for manufacturing cured product thereof, cured product, and printed wiring board including the sameTAIYO HOLDINGS CO LTD·Filed 2013·Granted Sep 27, 2016·1 cites·21 claims
- 1164US9265156B2Curable composition, cured coating film prepared from curable composition, and printed wiring board including the cured filmTAIYO INK MFG CO LTD·Filed 2014·Granted Feb 16, 2016·1 cites·20 claims
- 1264US2024018295A1Thermosetting resin composition, cured product, and printed wiring boardTAIYO INK MFG CO LTD·Filed 2021·Application pending·0 cites
- 1352US2024351939A1Substrate for mounting led and led-mounted substrateTAIYO HOLDINGS CO LTD·Filed 2022·Application pending·0 cites
- 1448US10759890B2Curable composition for printed circuit board, and cured coating film and printed circuit board incorporating sameTAIYO INK MFG CO LTD·Filed 2014·Granted Sep 1, 2020·0 cites·19 claims
- 1548US2015090482A1Curable composition for printed circuit board, cured coating film using the same, and printed circuit boardTAIYO INK MFG CO LTD·Filed 2014·Application pending·0 cites
- 1643US10907066B2Curable composition for ink-jet printing, cured object, and printed wiring boardTAIYO INK MFG CO LTD·Filed 2017·Granted Feb 2, 2021·0 cites·20 claims
- 1742US2021032486A1Curable composition, cured product of the same, and electronic component having cured productTAIYO INK MFG CO LTD·Filed 2019·Application pending·0 cites
- 1839US2021017412A1Curable composition for inkjet printing, cured product thereof, and electronic component having the cured product thereofTAIYO INK MFG CO LTD·Filed 2019·Application pending·0 cites
- 1939US2014121091A1Variable cutoff folding device and printer comprising variable cutoff folding deviceTOKYO KIKAI SEISAKUSHO LTD·Filed 2013·Application pending·0 cites
- 2039US2021017410A1Curable composition for inkjet, cured product of same, and electronic component comprising said cured productTAIYO INK MFG CO LTD·Filed 2019·Application pending·0 cites
- 2135US6070780ABonding apparatusSHINKAWA KK·Filed 1997·Granted Jun 6, 2000·11 cites·3 claims
- 2234US5208464ADevice for detecting errors in top/bottom/front/back orientation of a lead frameSHINKAWA KK·Filed 1991·Granted May 4, 1993·9 cites·1 claims
- 2326US6059846ABonding wire height inspection deviceSHINKAWA KK·Filed 1998·Granted May 9, 2000·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →