Inventor · disambiguated record
Masaaki Shinohara
Also filed as: SHINOHARA MASAAKI
44 granted patents·8 pending applications·188 citations·filing 1982–2024
97Inventor score
Files withRENESAS ELECTRONICS CORP30RISO KAGAKU CORP6RENESAS TECH CORP4SHINOHARA MASAAKI3KANSAI PAINT CO LTD2
Top patents by PatentIndex Score
52 records- 0193US9318500B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Apr 19, 2016·12 cites·7 claims
- 0290US7663179B2Semiconductor device with rewritable nonvolatile memory cellRENESAS TECH CORP·Filed 2006·Granted Feb 16, 2010·14 cites·14 claims
- 0388US9935125B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Apr 3, 2018·6 cites·10 claims
- 0488US2024395823A1Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0586US8492230B2Semiconductor device and method of manufacturing the sameISHIKAWA KOZO·Filed 2010·Granted Jul 23, 2013·15 cites·21 claims
- 0685US8777216B2Image forming apparatusRISO KAGAKU CORP·Filed 2013·Granted Jul 15, 2014·6 cites·5 claims
- 0784US10109626B2Semiconductor device and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Oct 23, 2018·4 cites·14 claims
- 0883US12080716B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Granted Sep 3, 2024·0 cites·12 claims
- 0983US9827791B2Printer with lower conveyerRISO KAGAKU CORP·Filed 2017·Granted Nov 28, 2017·2 cites·1 claims
- 1082US9947679B2Method of manufacturing semiconductor device with separately formed insulating films in main circuit and memory regionsRENESAS ELECTRONICS CORP·Filed 2015·Granted Apr 17, 2018·4 cites·14 claims
- 1182US7348245B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Mar 25, 2008·10 cites·13 claims
- 1281US10163922B2Semiconductor device and method of manufacturing the semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 25, 2018·3 cites·15 claims
- 1381US9418996B2Method of manufacturing semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Aug 16, 2016·2 cites·5 claims
- 1480US9305824B2Method of manufacturing semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Apr 5, 2016·2 cites·19 claims
- 1579US10546946B2Method for manufacturing semiconductor device having thinned finsRENESAS ELECTRONICS CORP·Filed 2017·Granted Jan 28, 2020·2 cites·11 claims
- 1679US8003301B2Manufacturing method for semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted Aug 23, 2011·5 cites·8 claims
- 1777US9633859B2Semiconductor device and a manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted Apr 25, 2017·2 cites·10 claims
- 1875US9643806B2Paper transfer deviceRISO KAGAKU CORP·Filed 2016·Granted May 9, 2017·1 cites·2 claims
- 1975US6059866AAir washerSANKI ENG CO LTD·Filed 1998·Granted May 9, 2000·61 cites·4 claims
- 2073US11695012B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2020·Granted Jul 4, 2023·0 cites·31 claims
- 2170US8308156B2Feeding mechanism for printerSHINOHARA MASAAKI·Filed 2009·Granted Nov 13, 2012·4 cites·4 claims
- 2270US7740351B2Ink-jet printing machine and printing methodRISO KAGAKU CORP·Filed 2006·Granted Jun 22, 2010·3 cites·6 claims
- 2367US10756115B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Aug 25, 2020·0 cites·19 claims
- 2467US7661670B2Sheet discharge deviceRISO KAGAKU CORP·Filed 2008·Granted Feb 16, 2010·3 cites·4 claims
- 2567US7118972B2Method of manufacture of a semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Oct 10, 2006·9 cites·9 claims
- 2666US8823112B2Semiconductor device having mixedly mounted components with common film layers and method of manufacturing the sameSHINOHARA MASAAKI·Filed 2012·Granted Sep 2, 2014·2 cites·17 claims
- 2764US2025176179A1Three-dimensional memory device with dummy slit regions and methods of making the sameWESTERN DIGITAL TECH INC·Filed 2024·Application pending·0 cites
- 2863US9553121B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Jan 24, 2017·1 cites·14 claims
- 2963US7989283B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Aug 2, 2011·2 cites·16 claims
- 3060US11217682B2Method for manufacturing semiconductor device having thinned finsRENESAS ELECTRONICS CORP·Filed 2019·Granted Jan 4, 2022·0 cites·5 claims
- 3160US10510775B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 17, 2019·0 cites·20 claims
- 3259US9960075B2Method of manufacturing semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted May 1, 2018·0 cites·3 claims
- 3359US4436849AAqueous resin compositionKANSAI PAINT CO LTD·Filed 1982·Granted Mar 13, 1984·13 cites·49 claims
- 3457US10483114B2Method of manufacturing semiconductor device having a nonvolatile memory and a MISFETRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 19, 2019·0 cites·12 claims
- 3557US9666584B2Method of manufacturing semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted May 30, 2017·0 cites·4 claims
- 3656US2025140688A1Three-dimensional memory device containing dummy via cavities and method for making sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 3755US9679908B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Jun 13, 2017·0 cites·11 claims
- 3852US9070564B2Semiconductor device having mixedly mounted components with common film layers and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 30, 2015·0 cites·12 claims
- 3952US2018047746A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 4052US2018350656A1Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 4151US9905429B2Semiconductor device and a manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Feb 27, 2018·0 cites·5 claims
- 4250US9837427B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 5, 2017·0 cites·15 claims
- 4348US10074556B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Sep 11, 2018·0 cites·5 claims
- 4445US2008194109A1Method of fabricating a semiconductor deviceRENESAS TECH CORP·Filed 2008·Application pending·0 cites
- 4545US2014377889A1Semiconductor device manufacturing methodRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 4642US10032667B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Jul 24, 2018·0 cites·14 claims
- 4742US9914613B2Mechanism for discharging sheets in apparatus for processing sheets and apparatus for reading images provided with the mechanismNISCA CORP·Filed 2015·Granted Mar 13, 2018·0 cites·7 claims
- 4841US9834015B2Printing machineRISO KAGAKU CORP·Filed 2016·Granted Dec 5, 2017·0 cites·2 claims
- 4940US8652955B2Manufacturing method of semiconductor integrated circuit deviceSHINOHARA MASAAKI·Filed 2012·Granted Feb 18, 2014·0 cites·20 claims
- 5038US2012188314A1Inkjet printing apparatusAKIYAMA TOMOYUKI·Filed 2011·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →