Inventor · disambiguated record
Masayuki Soutome
Also filed as: SOUTOME MASAYUKI
7 granted patents·4 pending applications·95 citations·filing 2005–2020
80Inventor score
Top patents by PatentIndex Score
11 records- 0195USD587662SSemiconductor deviceFUJI ELEC DEVICE TECH CO LTD·Filed 2008·Granted Mar 3, 2009·83 cites·1 claims
- 0277US7723846B2Power semiconductor module and method of manufacturing the sameFUJI ELEC DEVICE TECH CO LTD·Filed 2005·Granted May 25, 2010·9 cites·12 claims
- 0358US8158458B2Power semiconductor module and method of manufacturing the sameIKAWA OSAMU·Filed 2009·Granted Apr 17, 2012·3 cites·19 claims
- 0455US2009286093A1Lead-free solderFUJI ELEC DEVICE TECH CO LTD·Filed 2009·Application pending·0 cites
- 0551US11107787B2Member for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Aug 31, 2021·0 cites·9 claims
- 0651US10153246B2Method for producing member for semiconductor device and semiconductor device, and member for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Dec 11, 2018·0 cites·16 claims
- 0750US11107784B2Semiconductor device having circuit board to which contact part is bondedFUJI ELECTRIC CO LTD·Filed 2020·Granted Aug 31, 2021·0 cites·14 claims
- 0848US2013306296A1Semiconductor module radiator plate fabrication method, radiator plate, and semiconductor module using the sameFUJI ELECTRIC CO LTD·Filed 2013·Application pending·0 cites
- 0947US10262874B2Semiconductor module radiator plate fabrication method, radiator plate, and semiconductor module using the sameFUJI ELECTRIC CO LTD·Filed 2016·Granted Apr 16, 2019·0 cites·6 claims
- 1047US2007029678A1Lead-free solderMAKITA KAZUYUKI·Filed 2006·Application pending·0 cites
- 1146US2012111924A1Lead-free solderMAKITA KAZUYUKI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →