Inventor · disambiguated record
Matthias Steiert
Also filed as: STEIERT MATTHIAS
15 granted patents·1 pending application·36 citations·filing 2010–2020
89Inventor score
Files withINFINEON TECHNOLOGIES AG11LOS GATOS PHARMACEUTICALS INC3CABLE MICHAEL D1MATRIX SENSORS INC1
Top patents by PatentIndex Score
16 records- 0190US9475691B1Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 25, 2016·14 cites·20 claims
- 0288US10549985B2Semiconductor package with a through port for sensor applicationsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 4, 2020·4 cites·15 claims
- 0386US8424370B2Liquid analysis using capacitative micromachined ultrasound transducersCABLE MICHAEL D·Filed 2010·Granted Apr 23, 2013·6 cites·9 claims
- 0482US10486961B2Method for producing a MEMS sensor, and MEMS sensorINFINEON TECHNOLOGIES AG·Filed 2018·Granted Nov 26, 2019·2 cites·16 claims
- 0579US10064855B2Composite nanoparticles and uses thereofLOS GATOS PHARMACEUTICALS INC·Filed 2017·Granted Sep 4, 2018·6 cites·24 claims
- 0676US8733154B2Liquid analysis using capacitative micromachined ultrasound transducersMATRIX SENSORS INC·Filed 2013·Granted May 27, 2014·2 cites·6 claims
- 0774US10616703B2MEMS sound transducer element and method for producing a MEMS sound transducer elementINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 7, 2020·1 cites·25 claims
- 0858US10793429B2Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assemblyINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 6, 2020·0 cites·20 claims
- 0957US11342298B2Die stack arrangement comprising a die-attach-film tape and method for producing sameINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 24, 2022·0 cites·18 claims
- 1057US10584028B2Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assemblyINFINEON TECHNOLOGIES AG·Filed 2018·Granted Mar 10, 2020·0 cites·12 claims
- 1156US10155657B2Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an openingINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 18, 2018·1 cites·26 claims
- 1251US10861818B2Die stack arrangement comprising a die-attach-film tape and method for producing sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 8, 2020·0 cites·19 claims
- 1348US10407437B2Camptothecin derivatives and uses thereofLOS GATOS PHARMACEUTICALS INC·Filed 2017·Granted Sep 10, 2019·0 cites·3 claims
- 1448US10377626B2Apparatus with a high heat capacity and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 13, 2019·0 cites·21 claims
- 1547US11402556B2Wafer level method for manufacturing integrated infrared (IR) emitter elements having an optical IR filter placed on the main surface region of the carrier substrate on which the IR emitter is formedINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 2, 2022·0 cites·14 claims
- 1645US2018369232A1Composite Nanoparticles And Uses ThereofLOS GATOS PHARMACEUTICALS INC·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Matthias Steiert files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →