Inventor · disambiguated record
Mai Sugawara
Also filed as: SUGAWARA MAI
11 granted patents·8 pending applications·16 citations·filing 2010–2024
84Inventor score
Top patents by PatentIndex Score
19 records- 0183US9796953B2Cleaning liquid for lithography and method for cleaning substrateTOKYO OHKA KOGYO CO LTD·Filed 2015·Granted Oct 24, 2017·2 cites·18 claims
- 0283US8623131B2Surface treatment agent and surface treatment methodYOSHIDA MASAAKI·Filed 2010·Granted Jan 7, 2014·4 cites·4 claims
- 0379US8410296B2Surface treatment agent and surface treatment methodYOSHIDA MASAAKI·Filed 2010·Granted Apr 2, 2013·3 cites·8 claims
- 0476US9405199B2Method for forming resist patternTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Aug 2, 2016·2 cites·7 claims
- 0572US12428737B2Cleaning liquid used for cleaning metal resists, and cleaning method using cleaning liquidTOKYO OHKA KOGYO CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·13 claims
- 0672US9796879B2Film-forming materialTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Oct 24, 2017·1 cites·10 claims
- 0772US9133352B2Surface treatment agent and surface treatment methodTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted Sep 15, 2015·3 cites·9 claims
- 0867US12428611B2Cleaning liquid used for cleaning metal resists, and cleaning method using cleaning liquidTOKYO OHKA KOGYO CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·9 claims
- 0964US11965111B2Surface treatment agent and surface treatment methodTOKYO OHKA KOGYO CO LTD·Filed 2019·Granted Apr 23, 2024·1 cites·2 claims
- 1064US2024117280A1Metal residue removing liquid, metal residue removing method, and metal wiring manufacturing methodTOKYO OHKA KOGYO CO LTD·Filed 2023·Application pending·0 cites
- 1156US2024384169A1Etching solution, etching method, and method for manufacturing semiconductor deviceTOKYO OHKA KOGYO CO LTD·Filed 2024·Application pending·0 cites
- 1253US11120994B2Etching solution, and method of producing semiconductor elementTOKYO OHKA KOGYO CO LTD·Filed 2019·Granted Sep 14, 2021·0 cites·4 claims
- 1352US2024384170A1Etching solution, etching method, and method for manufacturing semiconductor deviceTOKYO OHKA KOGYO CO LTD·Filed 2024·Application pending·0 cites
- 1445US2015184047A1Method for modifying substrate surface, modifying film and coating solution used for modification of substrate surfaceTOKYO OHKA KOGYO CO LTD·Filed 2013·Application pending·0 cites
- 1543US8980534B2Method for forming fine pattern, and coating agent for pattern finingTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted Mar 17, 2015·0 cites·4 claims
- 1643US2020190672A1Etching solution, method for processing object to be processed, and method for manufacturing semiconductor elementTOKYO OHKA KOGYO CO LTD·Filed 2019·Application pending·0 cites
- 1738US2013122425A1Method for forming fine pattern, and coating forming agent for pattern finingTOKYO OHKA KOGYO CO LTD·Filed 2012·Application pending·0 cites
- 1837US2011054184A1Surface treatment agent and surface treatment methodTOKYO OHKA KOGYO CO LTD·Filed 2010·Application pending·0 cites
- 1931US2015368597A1Stripping solution that is used for removal of titanium or a titanium compound and method of wiring formationTOKYO OHKA KOGYO CO LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Mai Sugawara files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →