Inventor · disambiguated record
Mark F. Sylvester
Also filed as: SYLVESTER MARK · SYLVESTER MARK A · SYLVESTER MARK F
23 granted patents·5 pending applications·1,203 citations·filing 1992–2005
97Inventor score
Files withGORE & ASS15GORE ENTERPRISE HOLDINGS INC3PLEXUS SCIENT CORP23M INNOVATIVE PROPERTIES CO1MIXED GRILL L L C1
Top patents by PatentIndex Score
28 records- 0197US6847527B2Interconnect module with reduced power distribution impedance3M INNOVATIVE PROPERTIES CO·Filed 2002·Granted Jan 25, 2005·127 cites·63 claims
- 0293US6015722AMethod for assembling an integrated circuit chip package having an underfill material between a chip and a substrateGORE ENTERPRISE HOLDINGS INC·Filed 1999·Granted Jan 18, 2000·143 cites·2 claims
- 0390US5919329AMethod for assembling an integrated circuit chip package having at least one semiconductor deviceGORE ENTERPRISE HOLDINGS INC·Filed 1998·Granted Jul 6, 1999·102 cites·1 claims
- 0489US6183592B1Method for minimizing warp in the production of electronic assembliesFiled 1998·Granted Feb 6, 2001·55 cites·9 claims
- 0587US6014317AChip package mounting structure for controlling warp of electronic assemblies due to thermal expansion effectsGORE & ASS·Filed 1998·Granted Jan 11, 2000·79 cites·10 claims
- 0686US5900312AIntegrated circuit chip package assemblyGORE & ASS·Filed 1996·Granted May 4, 1999·43 cites·2 claims
- 0786US5847327ADimensionally stable core for use in high density chip packagesGORE & ASS·Filed 1996·Granted Dec 8, 1998·77 cites·9 claims
- 0885US6248959B1Substrate with die area having same CTE as ICGORE & ASS·Filed 1999·Granted Jun 19, 2001·39 cites·4 claims
- 0984US6011697AConstraining ring for use in electronic packagingGORE & ASS·Filed 1998·Granted Jan 4, 2000·43 cites·17 claims
- 1082US5868887AMethod for minimizing warp and die stress in the production of an electronic assemblyGORE & ASS·Filed 1996·Granted Feb 9, 1999·61 cites·9 claims
- 1181US6344371B2Dimensionally stable core for use in high density chip packages and a method of fabricating sameGORE & ASS·Filed 1998·Granted Feb 5, 2002·57 cites·11 claims
- 1281US5838063AMethod of increasing package reliability using package lids with plane CTE gradientsGORE & ASS·Filed 1996·Granted Nov 17, 1998·54 cites·25 claims
- 1378US5970319AMethod for assembling an integrated circuit chip package having at least one semiconductor deviceGORE ENTERPRISE HOLDINGS INC·Filed 1999·Granted Oct 19, 1999·46 cites·2 claims
- 1477US6027590AMethod for minimizing warp and die stress in the production of an electronic assemblyGORE & ASS·Filed 1998·Granted Feb 22, 2000·44 cites·12 claims
- 1576US6184589B1Constraining ring for use in electronic packagingFiled 1998·Granted Feb 6, 2001·39 cites·7 claims
- 1675US6127250AMethod of increasing package reliability by designing in plane CTE gradientsGORE & ASS·Filed 1998·Granted Oct 3, 2000·35 cites·9 claims
- 1775US5888631AMethod for minimizing warp in the production of electronic assembliesGORE & ASS·Filed 1996·Granted Mar 30, 1999·30 cites·4 claims
- 1867US5888630AApparatus and method for unit area composition control to minimize warp in an integrated circuit chip package assemblyGORE & ASS·Filed 1996·Granted Mar 30, 1999·26 cites·4 claims
- 1965US5778523AMethod for controlling warp of electronic assemblies by use of package stiffenerGORE & ASS·Filed 1996·Granted Jul 14, 1998·26 cites·6 claims
- 2063US5287619AMethod of manufacture multichip module substrateROGERS CORP·Filed 1992·Granted Feb 22, 1994·46 cites·21 claims
- 2155US5983974AMethod of making a lid for a chip/package systemGORE & ASS·Filed 1998·Granted Nov 16, 1999·17 cites·6 claims
- 2250US7593933B2Method and apparatus for a collaborative interaction networkMIXED GRILL L L C·Filed 2004·Granted Sep 22, 2009·3 cites·27 claims
- 2349US5879786AConstraining ring for use in electronic packagingGORE & ASS·Filed 1996·Granted Mar 9, 1999·11 cites·6 claims
- 2444US2006124019A1Conduit-clearing pyrotechnic device for remediation of residual explosive contaminationPLEXUS SCIENT CORP·Filed 2004·Application pending·0 cites
- 2540US2001023533A1Method of increasing package reliability using package lids with plane CTE GradientsFiled 2001·Application pending·0 cites
- 2635US2004099958A1Crack resistant interconnect moduleFiled 2002·Application pending·0 cites
- 2735US2006180043A1System and method for remediation of explosive contamination using convective heatPLEXUS SCIENT CORP·Filed 2005·Application pending·0 cites
- 2832US2004104463A1Crack resistant interconnect moduleFiled 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Mark F. Sylvester files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →