Inventor · disambiguated record
Mark A. Takacs
Also filed as: TAKACS MARK A · TAKACS MARK ANTHONY
18 granted patents·685 citations·filing 1984–2002
96Inventor score
Files withIBM18
Top patents by PatentIndex Score
18 records- 0196US6336262B1Process of forming a capacitor with multi-level interconnection technologyIBM·Filed 1997·Granted Jan 8, 2002·174 cites·26 claims
- 0287US6596621B1Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrateIBM·Filed 2002·Granted Jul 22, 2003·61 cites·20 claims
- 0387US5094769ACompliant thermally conductive compoundIBM·Filed 1988·Granted Mar 10, 1992·76 cites·45 claims
- 0482US4599136AMethod for preparation of semiconductor structures and devices which utilize polymeric dielectric materialsIBM·Filed 1984·Granted Jul 8, 1986·56 cites·19 claims
- 0574US5808853ACapacitor with multi-level interconnection technologyIBM·Filed 1997·Granted Sep 15, 1998·38 cites·22 claims
- 0672US5213704AProcess for making a compliant thermally conductive compoundIBM·Filed 1991·Granted May 25, 1993·26 cites·6 claims
- 0772US4665007APlanarization process for organic filling of deep trenchesIBM·Filed 1985·Granted May 12, 1987·51 cites·10 claims
- 0868US4749621AElectronic components comprising polyimide-filled isolation structuresIBM·Filed 1986·Granted Jun 7, 1988·33 cites·10 claims
- 0961US4654223AMethod for forming a film of dielectric material on an electric componentIBM·Filed 1986·Granted Mar 31, 1987·26 cites·19 claims
- 1059US4656050AMethod of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymersIBM·Filed 1986·Granted Apr 7, 1987·24 cites·25 claims
- 1158US5135595AProcess for fabricating a low dielectric composite substrateIBM·Filed 1990·Granted Aug 4, 1992·24 cites·9 claims
- 1257US4568601AUse of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structuresIBM·Filed 1984·Granted Feb 4, 1986·19 cites·27 claims
- 1353US5139851ALow dielectric composite substrateIBM·Filed 1990·Granted Aug 18, 1992·22 cites·19 claims
- 1451US5277725AProcess for fabricating a low dielectric composite substrateIBM·Filed 1992·Granted Jan 11, 1994·17 cites·15 claims
- 1550US4871619AElectronic components comprising polymide dielectric layersIBM·Filed 1986·Granted Oct 3, 1989·17 cites·11 claims
- 1650US4699803AMethod for forming electrical components comprising cured vinyl and/or acetylene terminated copolymersIBM·Filed 1984·Granted Oct 13, 1987·15 cites·32 claims
- 1740US6555912B1Corrosion-resistant electrode structure for integrated circuit decoupling capacitorsIBM·Filed 2001·Granted Apr 29, 2003·2 cites·12 claims
- 1832US4622383AMethod for the fractionation of reactive terminated polymerizable oligomersIBM·Filed 1985·Granted Nov 11, 1986·4 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →