Inventor · disambiguated record
Manabu Takakuwa
Also filed as: TAKAKUWA MANABU
29 granted patents·6 pending applications·49 citations·filing 2001–2024
93Inventor score
Top patents by PatentIndex Score
35 records- 0184US11935775B2Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2020·Granted Mar 19, 2024·1 cites·18 claims
- 0280US11152218B2Template, imprint apparatus, imprint method and imprint apparatus management methodTOSHIBA MEMORY CORP·Filed 2019·Granted Oct 19, 2021·2 cites·12 claims
- 0380US9966284B2Alignment method, pattern formation system, and exposure deviceTOSHIBA MEMORY CORP·Filed 2016·Granted May 8, 2018·3 cites·11 claims
- 0480US8765034B2Pattern formation method, pattern formation apparatus, and recording medium recorded with alignment programTOSHIBA KK·Filed 2013·Granted Jul 1, 2014·3 cites·14 claims
- 0579US6741327B2Method of correcting projection optical system and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2001·Granted May 25, 2004·17 cites·5 claims
- 0677US10283392B2Alignment method, pattern formation system, and exposure deviceTOSHIBA MEMORY CORP·Filed 2018·Granted May 7, 2019·2 cites·19 claims
- 0776US11267237B2Substrate bonding apparatusKIOXIA CORP·Filed 2020·Granted Mar 8, 2022·1 cites·13 claims
- 0876US9784573B2Positional deviation measuring device, non-transitory computer-readable recording medium containing a positional deviation measuring program, and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2015·Granted Oct 10, 2017·2 cites·6 claims
- 0974US10921722B2Exposure apparatus, exposure method, and semiconductor device manufacturing methodTOSHIBA MEMORY CORP·Filed 2018·Granted Feb 16, 2021·1 cites·13 claims
- 1071US11984313B2Semiconductor wafer, manufacturing method for semiconductor wafer, and manufacturing method for semiconductor deviceKIOXIA CORP·Filed 2022·Granted May 14, 2024·0 cites·6 claims
- 1168US10295409B2Substrate measurement system, method of measuring substrate, and computer program productTOSHIBA MEMORY CORP·Filed 2016·Granted May 21, 2019·1 cites·15 claims
- 1268US9952505B2Imprint device and pattern forming methodTOSHIBA MEMORY CORP·Filed 2014·Granted Apr 24, 2018·1 cites·7 claims
- 1368US6842230B2Exposing methodTOSHIBA KK·Filed 2002·Granted Jan 11, 2005·13 cites·14 claims
- 1466US12510830B2Measuring device and measuring methodKIOXIA CORP·Filed 2024·Granted Dec 30, 2025·0 cites·11 claims
- 1566US9632407B2Mask processing apparatus and mask processing methodTOSHIBA KK·Filed 2014·Granted Apr 25, 2017·1 cites·17 claims
- 1663US10241397B2Imprint apparatus and imprint methodTOSHIBA MEMORY CORP·Filed 2014·Granted Mar 26, 2019·1 cites·4 claims
- 1758US2021066068A1Semiconductor wafer, manufacturing method for semiconductor wafer, and manufacturing method for semiconductor deviceKIOXIA CORP·Filed 2020·Application pending·0 cites
- 1856US2023408936A1Semiconductor structure body and method for manufacturing semiconductor structure bodyKIOXIA CORP·Filed 2023·Application pending·0 cites
- 1951US11715660B2Position measuring apparatus and measuring methodKIOXIA CORP·Filed 2021·Granted Aug 1, 2023·0 cites·20 claims
- 2049US9396299B2Reticle mark arrangement method and nontransitory computer readable medium storing a reticle mark arrangement programTOSHIBA KK·Filed 2014·Granted Jul 19, 2016·0 cites·18 claims
- 2149US9240336B2Imprint method and imprint apparatusTOSHIBA KK·Filed 2014·Granted Jan 19, 2016·0 cites·20 claims
- 2246US2017040196A1Template, imprint apparatus, imprint method and imprint apparatus management methodTOSHIBA KK·Filed 2015·Application pending·0 cites
- 2345US11460765B2Exposure method, exposure apparatus, and semiconductor device manufacturing methodKIOXIA CORP·Filed 2020·Granted Oct 4, 2022·0 cites·18 claims
- 2445US10627726B2Patterning support system, patterning method, and nonvolatile recording mediumTOSHIBA MEMORY CORP·Filed 2019·Granted Apr 21, 2020·0 cites·16 claims
- 2545US10276459B2Measurement method, measurement program, and measurement systemTOSHIBA MEMORY CORP·Filed 2017·Granted Apr 30, 2019·0 cites·17 claims
- 2645US9087875B2Pattern formation method for manufacturing semiconductor device using phase-separating self-assembling materialTOSHIBA KK·Filed 2013·Granted Jul 21, 2015·0 cites·18 claims
- 2744US9966316B2Deposition supporting system, depositing apparatus and manufacturing method of a semiconductor deviceTOSHIBA MEMORY CORP·Filed 2016·Granted May 8, 2018·0 cites·20 claims
- 2843US2014340660A1Pattern formation method and pattern formation apparatusTOSHIBA KK·Filed 2013·Application pending·0 cites
- 2942US9541847B2Imprint method and imprint systemSUZUKI MASATO·Filed 2012·Granted Jan 10, 2017·0 cites·5 claims
- 3042US9188879B2Substrate holding apparatus, pattern transfer apparatus, and pattern transfer methodKASA KENTARO·Filed 2012·Granted Nov 17, 2015·0 cites·20 claims
- 3141US2014094015A1Alignment measurement system, overlay measurement system, and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 3239US10093044B2Imprinting apparatus and imprinting methodTOSHIBA MEMORY CORP·Filed 2015·Granted Oct 9, 2018·0 cites·4 claims
- 3338US8953163B2Exposure apparatus, exposure method, and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2013·Granted Feb 10, 2015·0 cites·20 claims
- 3437US9941177B2Pattern accuracy detecting apparatus and processing systemTOSHIBA MEMORY CORP·Filed 2016·Granted Apr 10, 2018·0 cites·13 claims
- 3536US2012068372A1Nanoimprint template and pattern transcription apparatusMIMOTOGI AKIKO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →