Inventor · disambiguated record
Masashi Takase
Also filed as: TAKASE MASASHI
2 granted patents·1 pending application·20 citations·filing 1997–2005
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0178US7800227B2Semiconductor device with crack-resistant multilayer copper wiringFUJITSU SEMICONDUCTOR LTD·Filed 2005·Granted Sep 21, 2010·12 cites·11 claims
- 0237US6013924ASemiconductor integrated circuit and method for making wiring layout of semiconductor integrated circuitFUJITSU LTD·Filed 1997·Granted Jan 11, 2000·8 cites·13 claims
- 0337US2006022691A1Semiconductor deviceFUJITSU LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →