Inventor · disambiguated record
Masakazu Takesue
Also filed as: TAKESUE MASAKAZU
17 granted patents·5 pending applications·220 citations·filing 1995–2015
94Inventor score
Files withFUJITSU LTD22
Top patents by PatentIndex Score
22 records- 0189US6184475B1Lead-free solder composition with Bi, In and SnFUJITSU LTD·Filed 1995·Granted Feb 6, 2001·64 cites·12 claims
- 0283US6361626B1Solder alloy and soldered bondFUJITSU LTD·Filed 2001·Granted Mar 26, 2002·19 cites·4 claims
- 0379US6521176B2Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloyFUJITSU LTD·Filed 2000·Granted Feb 18, 2003·20 cites·3 claims
- 0477US6344690B1Semiconductor device with gold bumps, and method and apparatus of producing the sameFUJITSU LTD·Filed 2000·Granted Feb 5, 2002·15 cites·9 claims
- 0574US6495441B2Semiconductor device with gold bumps, and method and apparatus of producing the sameFUJITSU LTD·Filed 2000·Granted Dec 17, 2002·12 cites·1 claims
- 0669US6541898B2Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding methodFUJITSU LTD·Filed 2001·Granted Apr 1, 2003·14 cites·7 claims
- 0767US6428911B2Soldering method and soldered jointFUJITSU LTD·Filed 2001·Granted Aug 6, 2002·15 cites·9 claims
- 0866US7753251B2Micro component removing apparatusFUJITSU LTD·Filed 2007·Granted Jul 13, 2010·2 cites·4 claims
- 0966US6467141B2Method of assembling micro-actuatorFUJITSU LTD·Filed 2001·Granted Oct 22, 2002·12 cites·14 claims
- 1062US6786385B1Semiconductor device with gold bumps, and method and apparatus of producing the sameFUJITSU LTD·Filed 2000·Granted Sep 7, 2004·6 cites·5 claims
- 1162US6333554B1Semiconductor device with gold bumps, and method and apparatus of producing the sameFUJITSU LTD·Filed 1998·Granted Dec 25, 2001·15 cites·8 claims
- 1260US7491893B2Mounting substrate and mounting method of electronic partFUJITSU LTD·Filed 2004·Granted Feb 17, 2009·7 cites·14 claims
- 1359US6984254B2Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloyFUJITSU LTD·Filed 2003·Granted Jan 10, 2006·5 cites·11 claims
- 1458US6596094B2Solder paste and electronic deviceFUJITSU LTD·Filed 2001·Granted Jul 22, 2003·7 cites·21 claims
- 1555US6893512B2Solder alloy and soldered bondFUJITSU LTD·Filed 2003·Granted May 17, 2005·5 cites·3 claims
- 1652US7963434B2Micro component removing methodFUJITSU LTD·Filed 2010·Granted Jun 21, 2011·0 cites·2 claims
- 1749US2013256016A1Printed circuit board and manufacturing method thereofFUJITSU LTD·Filed 2012·Application pending·0 cites
- 1848US2010101848A1Substrate unit, information processor and method of manufacturing substrate unitFUJITSU LTD·Filed 2009·Application pending·0 cites
- 1947US6744183B2Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding methodFUJITSU LTD·Filed 2003·Granted Jun 1, 2004·2 cites·2 claims
- 2045US2015271928A1Printed circuit board and manufacturing method thereofFUJITSU LTD·Filed 2015·Application pending·0 cites
- 2140US2003095888A1Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloyFUJITSU LTD·Filed 2002·Application pending·0 cites
- 2238US2011141705A1Printed wiring board and electronic apparatusFUJITSU LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →