Inventor · disambiguated record
Masaya Takizawa
Also filed as: TAKIZAWA MASAYA
5 granted patents·1 pending application·0 citations·filing 2001–2024
58Inventor score
Top patents by PatentIndex Score
6 records- 0156US11792927B2Interconnect substrateSHINKO ELECTRIC IND CO·Filed 2022·Granted Oct 17, 2023·0 cites·8 claims
- 0254US11716810B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2022·Granted Aug 1, 2023·0 cites·7 claims
- 0352US12341088B2Wiring board and semiconductor device each having non-photosensitive thermosetting encapsulating layer over photosensitive resin layer of interconnect structureSHINKO ELECTRIC IND CO·Filed 2022·Granted Jun 24, 2025·0 cites·9 claims
- 0451US11729914B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2022·Granted Aug 15, 2023·0 cites·12 claims
- 0551US2024404978A1Wiring board, semiconductor device, and wiring board manufacturing methodSHINKO ELECTRIC IND CO·Filed 2024·Application pending·0 cites
- 0626US7230713B2Method for measuring gap of liquid crystal cellOTSUKA DENSHI KK·Filed 2001·Granted Jun 12, 2007·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →