Inventor · disambiguated record
Masahiro Tamaki
Also filed as: TAMAKI MASAHIRO
24 granted patents·667 citations·filing 1994–2001
97Inventor score
Top patents by PatentIndex Score
24 records- 0194US6391770B2Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 21, 2002·88 cites·9 claims
- 0294US5853559AApparatus for electroplating a semiconductor substrateMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Dec 29, 1998·101 cites·8 claims
- 0383US6136668AMethod of dicing semiconductor waferMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 24, 2000·62 cites·4 claims
- 0479US6537057B2Mold clamping apparatus for injection molding machineTOSHIBA MACHINE CO LTD·Filed 2001·Granted Mar 25, 2003·12 cites·4 claims
- 0576US6332355B1Method of estimating a life of ball screw included in electric injection molding machine and life estimating systemTOSHIBA MACHINE CO LTD·Filed 2000·Granted Dec 25, 2001·17 cites·7 claims
- 0676US6033540APlating apparatus for plating a waferMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Mar 7, 2000·38 cites·6 claims
- 0775US6325954B1Method of controlling electric injection unit of injection molding machineTOSHIBA MACHINE CO LTD·Filed 1999·Granted Dec 4, 2001·38 cites·1 claims
- 0874US6210554B1Method of plating semiconductor wafer and plated semiconductor waferMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Apr 3, 2001·34 cites·7 claims
- 0973US6533573B2Mold clamping apparatus for injection molding machineTOSHIBA MACHINE CO LTD·Filed 2001·Granted Mar 18, 2003·8 cites·4 claims
- 1072US6268619B1Semiconductor device with high aspect ratio via hole including solder repelling coatingMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jul 31, 2001·36 cites·5 claims
- 1172US6050804AClamping apparatus for injection molding machineTOSHIBA MACHINE CO LTD·Filed 1998·Granted Apr 18, 2000·31 cites·5 claims
- 1271US6059556AInjection apparatus for injection molding machineTOSHIBA MACHINE CO LTD·Filed 1998·Granted May 9, 2000·29 cites·4 claims
- 1370US6329671B1Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Dec 11, 2001·12 cites·4 claims
- 1470US6144182AMotor control method for injection molding machine and motor controller for carrying out the sameTOSHIBA MACHINE CO LTD·Filed 2000·Granted Nov 7, 2000·16 cites·5 claims
- 1564US6245596B1Method of producing semiconductor device with heat dissipation metal layer and metal projectionsMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jun 12, 2001·26 cites·9 claims
- 1662US6309203B1Injection apparatus for injection molding machineTOSHIBA MACHINE CO LTD·Filed 1998·Granted Oct 30, 2001·21 cites·10 claims
- 1761US6270333B1Mold clamping apparatus for injection molding machineTOSHIBA MACHINE CO LTD·Filed 1998·Granted Aug 7, 2001·16 cites·10 claims
- 1860US6500325B2Method of plating semiconductor wafer and plated semiconductor waferMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Dec 31, 2002·5 cites·3 claims
- 1953US6157077ASemiconductor device with plated heat sink and partially plated side surfacesMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Dec 5, 2000·16 cites·4 claims
- 2052US6132198AClamping apparatus for injection molding machineTOSHIBA MACHINE CO LTD·Filed 1998·Granted Oct 17, 2000·14 cites·10 claims
- 2149US6589815B1Method of manufacturing semiconductor device with plated heat sink by laser cuttingMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jul 8, 2003·3 cites·4 claims
- 2248US6109036ASealed hydraulic intensifierTOSHIBA MACHINE CO LTD·Filed 1998·Granted Aug 29, 2000·12 cites·5 claims
- 2348US6008537ASemiconductor device with heat dissipation metal layer and metal projectionsMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Dec 28, 1999·12 cites·4 claims
- 2445US5457072AProcess for dicing a semiconductor wafer having a plated heat sink using a temporary substrateMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Oct 10, 1995·20 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →