Inventor · disambiguated record
Mamoru Terai
Also filed as: ISHIBASHI LEGAL REPRESENTATIVE MIWAKO · TERAI MAMORU
11 granted patents·9 pending applications·35 citations·filing 2003–2019
87Inventor score
Top patents by PatentIndex Score
20 records- 0183US9343388B2Power semiconductor deviceTERAI MAMORU·Filed 2012·Granted May 17, 2016·8 cites·10 claims
- 0283US8402731B2Elevator ropeNAITO SHINYA·Filed 2009·Granted Mar 26, 2013·8 cites·15 claims
- 0380US10068825B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Sep 4, 2018·3 cites·10 claims
- 0475US8679727B2Developing method for immersion lithography, solvent used for the developing method and electronic device using the developing methodTERAI MAMORU·Filed 2009·Granted Mar 25, 2014·4 cites·8 claims
- 0571US8178983B2Water repellant composition for substrate to be exposed, method for forming resist pattern, electronic device produced by the formation method, treatment method for imparting water repellency to substrate to be exposed, water repellant set for substrate to be exposed, and treatment method for imparting water repellency to substrate to be exposed using the sameISHIBASHI TAKEO·Filed 2009·Granted May 15, 2012·3 cites·14 claims
- 0669US8674492B2Power moduleOTA TATSUO·Filed 2013·Granted Mar 18, 2014·3 cites·5 claims
- 0765US9385007B2Semiconductor device and method of manufacturing the sameTERAI MAMORU·Filed 2012·Granted Jul 5, 2016·2 cites·7 claims
- 0863US9153512B2Semiconductor device with an insulating terminal tableTERAI MAMORU·Filed 2011·Granted Oct 6, 2015·2 cites·11 claims
- 0959US9543252B2Semiconductor apparatus and method for producing the sameTERAI MAMORU·Filed 2012·Granted Jan 10, 2017·1 cites·14 claims
- 1056US9082707B2Semiconductor device and method for manufacturing semiconductor deviceHIRAMATSU SEIKI·Filed 2011·Granted Jul 14, 2015·1 cites·17 claims
- 1148US2006246380A1Micropattern forming material and method for forming micropatternRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 1245US2008194109A1Method of fabricating a semiconductor deviceRENESAS TECH CORP·Filed 2008·Application pending·0 cites
- 1345US2022259475A1Heat storage apparatusMITSUBISHI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 1445US2011192579A1Total heat exchange element and total heat exchangerMITSUBISHI ELECTRIC CORP·Filed 2010·Application pending·0 cites
- 1544US2012205081A1Total heat exchanger and method for producing partition plate used in sameTERAI MAMORU·Filed 2010·Application pending·0 cites
- 1643US8323879B2Method of forming resist patternTERAI MAMORU·Filed 2010·Granted Dec 4, 2012·0 cites·5 claims
- 1743US2007128559A1Material for forming fine pattern, method of forming fine pattern, method of manufacturing electronic device using the same, and electronic device manufactured from the sameRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 1842US2008241489A1Method of forming resist pattern and semiconductor device manufactured with the sameRENESAS TECH CORP·Filed 2008·Application pending·0 cites
- 1941US2004072096A1Micropattern forming material and fine structure forming methodRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 2037US2004029047A1Micropattern forming material, micropattern forming method and method for manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →