Inventor · disambiguated record
Mariko Teshiba
Also filed as: TESHIBA MARIKO
1 granted patent·4 pending applications·0 citations·filing 2021–2025
6Inventor score
Files withNITTO DENKO CORP5
Top patents by PatentIndex Score
5 records- 0148US11898071B2Pressure-sensitive adhesive sheet for semiconductor wafer processingNITTO DENKO CORP·Filed 2022·Granted Feb 13, 2024·0 cites·5 claims
- 0248US2021277288A1Pressure-sensitive adhesive tapeNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 0345US2025253183A1Pressure-sensitive adhesive tape for semiconductor wafer processingNITTO DENKO CORP·Filed 2025·Application pending·0 cites
- 0445US2023108829A1Pressure-sensitive adhesive composition to be used in pressure-sensitive adhesive tape for semiconductor processing and pressure-sensitive adhesive tape using the pressure-sensitive adhesive compositionNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 0545US2023107095A1Backgrinding tapeNITTO DENKO CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →