Inventor · disambiguated record
Masaya Toba
Also filed as: TOBA MASAYA
11 granted patents·21 pending applications·15 citations·filing 2016–2024
84Inventor score
Top patents by PatentIndex Score
32 records- 0193US11979990B2Wiring board and method for manufacturing the sameSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted May 7, 2024·3 cites·14 claims
- 0290US12004305B2Wiring board and production method for sameSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jun 4, 2024·2 cites·13 claims
- 0388US12426164B2Semiconductor packageRESONAC CORP·Filed 2024·Granted Sep 23, 2025·0 cites·8 claims
- 0487US10388608B2Semiconductor device and method for manufacturing sameHITACHI CHEMICAL CO LTD·Filed 2016·Granted Aug 20, 2019·8 cites·19 claims
- 0580US2024282684A1Substrate and method for manufacturing the sameRESONAC CORP·Filed 2024·Application pending·0 cites
- 0678US11990396B2Substrate and method for manufacturing the sameSHOWA DENKO MATERIALS CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 0776US2024383035A1Electronic component and method for manufacturing electronic componentRESONAC CORP·Filed 2024·Application pending·0 cites
- 0873US2024397635A1Wiring structure, method for manufacturing same, and semiconductor packageRESONAC CORP·Filed 2024·Application pending·0 cites
- 0971US10756008B2Organic interposer and method for manufacturing organic interposerHITACHI CHEMICAL CO LTD·Filed 2017·Granted Aug 25, 2020·1 cites·6 claims
- 1070US11562951B2Organic interposer and method for manufacturing organic interposerHITACHI CHEMICAL CO LTD·Filed 2020·Granted Jan 24, 2023·0 cites·20 claims
- 1167US12114437B2Wiring structure, method for manufacturing same, and semiconductor packageSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Oct 8, 2024·0 cites·9 claims
- 1267US10575402B2Resin composition, wiring layer laminate for semiconductor, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 25, 2020·1 cites·17 claims
- 1366US12376235B2Layered plate and wiring base board production methodRESONAC CORP·Filed 2020·Granted Jul 29, 2025·0 cites·12 claims
- 1465US2025293105A1Method for manufacturing semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 1565US2025259859A1Method for manufacturing semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 1661US2025287514A1Method for manufacturing electronic component deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 1758US12070800B2Electronic component and method for manufacturing electronic componentSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Aug 27, 2024·0 cites·6 claims
- 1855US2023259026A1Photosensitive resin composition, method of producing patterned cured product using the same, and cured product of photosensitive resin compositionSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 1954US2025142731A1Wiring substrate production method, wiring substrate, reticle, and exposure pattern-rendering data structureRESONAC CORP·Filed 2023·Application pending·0 cites
- 2053US2025267799A1Method for manufacturing wiring board, method for evaluating resist layer or wiring board, and wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 2152US2024304462A1Method for manufacturing wiring board and layered plateRESONAC CORP·Filed 2022·Application pending·0 cites
- 2250US2024341039A1Method for manufacturing wiring board, and wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 2349US2024030044A1Method for manufacturing wiring board, method for manufacturing semiconductor device, and resin sheetRESONAC CORP·Filed 2021·Application pending·0 cites
- 2449US2025168975A1Core substrate for wiring boards and method for producing same, and wiring board and method for producing sameRESONAC CORP·Filed 2022·Application pending·0 cites
- 2549US2025132219A1Semiconductor device, method for manufacturing semiconductor device, and thermally conductive sheet for semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 2648US2024250025A1Method for manufacturing semiconductor device and semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 2747US2024057263A1Method for producing wiring board, laminate and method for producing sameRESONAC CORP·Filed 2021·Application pending·0 cites
- 2847US2024015889A1Method for producing wiring board, and wiring boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 2947US2025293200A1Laminate manufacturing method, insulation material, and laminateRESONAC CORP·Filed 2022·Application pending·0 cites
- 3046US2023253215A1Method for producing circuit boardRESONAC CORP·Filed 2020·Application pending·0 cites
- 3143US2024352275A1Cured resin film, semiconductor device and method for producing semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 3242US2024361697A1Method for selecting photosensitive resin composition, method for producing patterned cured film, cured film, semiconductor device, and method for producing semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →