Inventor · disambiguated record
Masashi Totokawa
Also filed as: TOTOKAWA MASASHI
13 granted patents·6 pending applications·124 citations·filing 2003–2021
90Inventor score
Top patents by PatentIndex Score
19 records- 0193US7458150B2Method of producing circuit boardDENSO CORP·Filed 2006·Granted Dec 2, 2008·54 cites·20 claims
- 0287US7068142B2Pressure-sensitive resistor and pressure-sensitive sensor using the sameDENSO CORP·Filed 2004·Granted Jun 27, 2006·25 cites·15 claims
- 0376US7357883B2Conductive adhesive, method of producing the same, and bonding methodDENSO CORP·Filed 2006·Granted Apr 15, 2008·3 cites·7 claims
- 0473US7276185B2Conductor composition, a mounting substrate and a mounting structure utilizing the compositionDENSO CORP·Filed 2004·Granted Oct 2, 2007·17 cites·6 claims
- 0571US10272491B2Soft magnetic member and manufacturing method of soft magnetic memberDENSO CORP·Filed 2014·Granted Apr 30, 2019·1 cites·5 claims
- 0671US7524893B2Conductive adhesiveHARIMA CHEMICALS INC·Filed 2005·Granted Apr 28, 2009·8 cites·13 claims
- 0763US6913947B2Multi-layer circuit board and method of manufacturing the sameDENSO CORP·Filed 2003·Granted Jul 5, 2005·10 cites·11 claims
- 0859US8703517B2Method of Manufacturing a Semiconductor Device Including Removing a Reformed LayerTAYA ATSUSHI·Filed 2011·Granted Apr 22, 2014·2 cites·15 claims
- 0959US7070829B2Production method of gas sensorULVAC INC·Filed 2003·Granted Jul 4, 2006·3 cites·14 claims
- 1051US8151649B2Physical quantity sensor device and method of manufacturing the sameTOTOKAWA MASASHI·Filed 2010·Granted Apr 10, 2012·1 cites·19 claims
- 1149US7807073B2Conductor composition, a mounting substrate and a mounting structure utilizing the compositionDENSO CORP·Filed 2007·Granted Oct 5, 2010·0 cites·12 claims
- 1246US10252338B2Method of manufacturing sintering diffusion joining member and manufacturing apparatus of the sameDENSO CORP·Filed 2015·Granted Apr 9, 2019·0 cites·8 claims
- 1343US2006009344A1Zirconia structural body and manufacturing method of the sameDENSO CORP·Filed 2005·Application pending·0 cites
- 1442US2021138763A1Bonded structure and method for producing same, and heat exchangerDENSO CORP·Filed 2021·Application pending·0 cites
- 1542US2005229379A1Multilayered gas sensor elementDENSO CORP·Filed 2005·Application pending·0 cites
- 1642US2010288636A1Laminated gas sensor and method of producing the sameDENSO CORP·Filed 2010·Application pending·0 cites
- 1737US2009013801A1Physical quantity sensor elementDENSO CORP·Filed 2008·Application pending·0 cites
- 1834US2011034032A1Method of formation or thermal spray coatingDENSO CORP·Filed 2010·Application pending·0 cites
- 1933US8603920B2Manufacturing method of semiconductor device including etching stepKANAMORI KATSUHIKO·Filed 2010·Granted Dec 10, 2013·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →