Inventor · disambiguated record
Man-Wen Tseng
Also filed as: TSENG Man-Wen
4 granted patents·2 pending applications·46 citations·filing 2017–2024
71Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG6
Top patents by PatentIndex Score
6 records- 0194US10037975B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 31, 2018·42 cites·18 claims
- 0283US10269771B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 23, 2019·4 cites·20 claims
- 0356US10879215B2Method for manufacturing a semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 29, 2020·0 cites·15 claims
- 0455US2025226341A1Bonding structure and package structureADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0551US2025070075A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 0641US11088057B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 10, 2021·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →