Inventor · disambiguated record
Masanori Tsuruta
Also filed as: TSURUTA MASANORI
7 granted patents·1 pending application·6 citations·filing 2012–2023
74Inventor score
Top patents by PatentIndex Score
8 records- 0182US10424648B2Copper and/or copper oxide dispersion, and electroconductive film formed using dispersionASAHI CHEMICAL IND·Filed 2014·Granted Sep 24, 2019·3 cites·8 claims
- 0272US12202996B2Copper oxide ink and method for producing conductive substrate using same, product containing coating film and method for producing product using same, method for producing product with conductive pattern, and product with conductive patternASAHI CHEMICAL IND·Filed 2023·Granted Jan 21, 2025·0 cites·12 claims
- 0369US11760895B2Copper oxide ink and method for producing conductive substrate using same, product containing coating film and method for producing product using same, method for producing product with conductive pattern, and product with conductive patternASAHI CHEMICAL IND·Filed 2018·Granted Sep 19, 2023·0 cites·10 claims
- 0467US11270809B2Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive patternASAHI CHEMICAL IND·Filed 2018·Granted Mar 8, 2022·1 cites·18 claims
- 0567US2019371901A1Copper and/or copper oxide dispersion, and electroconductive film formed using dispersionASAHI CHEMICAL IND·Filed 2019·Application pending·0 cites
- 0662US11328835B2Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive patternASAHI CHEMICAL IND·Filed 2021·Granted May 10, 2022·0 cites·13 claims
- 0760US8846186B2Layered product for metamaterial transfer and metamaterial transferred substrateTAKEGUCHI KEIGO·Filed 2012·Granted Sep 30, 2014·2 cites·7 claims
- 0855US11109492B2Structure including electroconductive pattern regions, method for producing same, stack, method for producing same, and copper wiringASAHI CHEMICAL IND·Filed 2018·Granted Aug 31, 2021·0 cites·41 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →