Inventor · disambiguated record
Mark E. Tuttle
Also filed as: TUTTLE MARK · TUTTLE MARK E · TUTTLE MARK EWING
279 granted patents·27 pending applications·14,352 citations·filing 1990–2025
99Inventor score
Files withMICRON TECHNOLOGY INC202MICRON COMMUNICATIONS INC47ROUND ROCK RES LLC16TUTTLE MARK E16KEYSTONE TECHNOLOGY SOLUTIONS5
Top patents by PatentIndex Score
306 records- 0199US6852550B2MRAM sense layer area controlMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 8, 2005·219 cites·38 claims
- 0299US6735183B2Radio frequency data communications deviceMICRON TECHNOLOGY INC·Filed 2000·Granted May 11, 2004·276 cites·45 claims
- 0399US6130602ARadio frequency data communications deviceMICRON TECHNOLOGY INC·Filed 1996·Granted Oct 10, 2000·581 cites·17 claims
- 0499US5621913ASystem with chip to chip communicationMICRON TECHNOLOGY INC·Filed 1994·Granted Apr 15, 1997·404 cites·21 claims
- 0599US5421769AApparatus for planarizing semiconductor wafers, and a polishing pad for a planarization apparatusMICRON TECHNOLOGY INC·Filed 1993·Granted Jun 6, 1995·238 cites·30 claims
- 0699US5234867AMethod for planarizing semiconductor wafers with a non-circular polishing padMICRON TECHNOLOGY INC·Filed 1992·Granted Aug 10, 1993·253 cites·4 claims
- 0799US5177908APolishing padMICRON TECHNOLOGY INC·Filed 1990·Granted Jan 12, 1993·299 cites·18 claims
- 0899US5020283APolishing pad with uniform abrasionMICRON TECHNOLOGY INC·Filed 1990·Granted Jun 4, 1991·303 cites·8 claims
- 0998US8106520B2Signal delivery in stacked deviceKEETH BRENT·Filed 2008·Granted Jan 31, 2012·296 cites·25 claims
- 1098US7902643B2Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 8, 2011·82 cites·22 claims
- 1198US7683458B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 23, 2010·54 cites·17 claims
- 1298US7545256B2System and method for identifying a radio frequency identification (RFID) deviceKEYSTONE TECHNOLOGY SOLUTIONS·Filed 2006·Granted Jun 9, 2009·59 cites·53 claims
- 1398US6721289B1Radio frequency data communications deviceMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 13, 2004·79 cites·25 claims
- 1498US6693513B2Wireless identification device, RFID device with push-on/push off switch, and method of manufacturing wireless identification deviceMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 17, 2004·229 cites·35 claims
- 1598US6375780B1Method of manufacturing an enclosed transceiverMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 23, 2002·239 cites·9 claims
- 1698US6357025B1Testing and burn-in of IC chips using radio frequency transmissionMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 12, 2002·121 cites·27 claims
- 1798US6325294B2Method of manufacturing an enclosed transceiverMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 4, 2001·153 cites·24 claims
- 1898US6167614B1Method of manufacturing and testing an electronic device, and an electronic deviceMICRON TECHNOLOGY INC·Filed 1999·Granted Jan 2, 2001·411 cites·21 claims
- 1998US6037879AWireless identification device, RFID device, and method of manufacturing wireless identification deviceMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 14, 2000·382 cites·32 claims
- 2098US5384284AMethod to form a low resistant bond pad interconnectMICRON SEMICONDUCTOR INC·Filed 1993·Granted Jan 24, 1995·405 cites·24 claims
- 2198US5297364APolishing pad with controlled abrasion rateMICRON TECHNOLOGY INC·Filed 1991·Granted Mar 29, 1994·261 cites·5 claims
- 2298US5142438ADram cell having a stacked capacitor with a tantalum lower plate, a tantalum oxide dielectric layer, and a silicide buried contactMICRON TECHNOLOGY INC·Filed 1991·Granted Aug 25, 1992·191 cites·14 claims
- 2397US10141259B1Semiconductor devices having electrically and optically conductive vias, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 27, 2018·16 cites·28 claims
- 2497US7385477B2Radio frequency data communications deviceKEYSTONE TECHNOLOGY SOLUTIONS·Filed 2005·Granted Jun 10, 2008·47 cites·51 claims
- 2597US7300857B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 27, 2007·166 cites·32 claims
- 2697US7106201B2Communication devices, remote intelligent communication devices, electronic communication devices, methods of forming remote intelligent communication devices and methods of forming a radio frequency identification deviceMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 12, 2006·124 cites·27 claims
- 2797US7012504B2Wireless identification device, RFID device with push-on/push off switch, and method of manufacturing wireless identification deviceMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 14, 2006·106 cites·22 claims
- 2897US6836472B2Radio frequency data communications deviceMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·94 cites·6 claims
- 2997US6785159B2Combination etch stop and in situ resistor in a magnetoresistive memory and methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 31, 2004·156 cites·53 claims
- 3097US6466131B1Radio frequency data communications device with adjustable receiver sensitivity and methodMICRON TECHNOLOGY INC·Filed 1996·Granted Oct 15, 2002·158 cites·19 claims
- 3197US6045652AMethod of manufacturing an enclosed transceiverMICRON COMMUNICATIONS INC·Filed 1998·Granted Apr 4, 2000·239 cites·14 claims
- 3297US5983363AIn-sheet transceiver testingMICRON COMMUNICATIONS INC·Filed 1994·Granted Nov 9, 1999·113 cites·5 claims
- 3397US5779839AMethod of manufacturing an enclosed transceiverMICRON COMMUNICATIONS INC·Filed 1997·Granted Jul 14, 1998·262 cites·10 claims
- 3497US5558679AMethod for mounting a battery on a substrateMICRON COMMUNICATIONS INC·Filed 1995·Granted Sep 24, 1996·155 cites·17 claims
- 3597US5232875AMethod and apparatus for improving planarity of chemical-mechanical planarization operationsMICRON TECHNOLOGY INC·Filed 1992·Granted Aug 3, 1993·397 cites·25 claims
- 3696US7517798B2Methods for forming through-wafer interconnects and structures resulting therefromMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 14, 2009·29 cites·13 claims
- 3796US7452743B2Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer levelAPTINA IMAGING CORP·Filed 2005·Granted Nov 18, 2008·52 cites·34 claims
- 3896US6515591B2Termite sensing methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 4, 2003·69 cites·8 claims
- 3996US6413788B1Keepers for MRAM electrodesMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 2, 2002·107 cites·36 claims
- 4096US6255959B1Electrical apparatuses, methods of forming electrical apparatuses, and termite sensing methodsMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 3, 2001·84 cites·34 claims
- 4196US5907477ASubstrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulantMICRON COMMUNICATIONS INC·Filed 1997·Granted May 25, 1999·290 cites·11 claims
- 4296US5776278AMethod of manufacturing an enclosed transceiverMICRON COMMUNICATIONS INC·Filed 1997·Granted Jul 7, 1998·162 cites·9 claims
- 4396US5151168AProcess for metallizing integrated circuits with electrolytically-deposited copperMICRON TECHNOLOGY INC·Filed 1990·Granted Sep 29, 1992·257 cites·25 claims
- 4495US7956443B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2010·Granted Jun 7, 2011·16 cites·17 claims
- 4595US7283035B2Radio frequency data communications device with selectively removable antenna portion and methodMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 16, 2007·26 cites·55 claims
- 4695US6781508B2Radio frequency data communications device with adjustable receiver sensitivity and methodMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 24, 2004·69 cites·23 claims
- 4795US6487681B1In-sheet transceiver testingMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 26, 2002·83 cites·20 claims
- 4895US6417561B1Keepers for MRAM electrodesMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 9, 2002·83 cites·40 claims
- 4995US6058497ATesting and burn-in of IC chips using radio frequency transmissionMICRON TECHNOLOGY INC·Filed 1992·Granted May 2, 2000·89 cites·22 claims
- 5095US5663598AElectrical circuit bonding interconnect component and flip chip interconnect bondMICRON COMMUNICATIONS INC·Filed 1995·Granted Sep 2, 1997·88 cites·14 claims
Showing the top 50 of 306 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →