Inventor · disambiguated record
Mark A. Tverdy
Also filed as: TVERDY MARK · TVERDY MARK A
9 granted patents·9 pending applications·82 citations·filing 1996–2025
86Inventor score
Files withMICRON TECHNOLOGY INC18
Top patents by PatentIndex Score
18 records- 0179US5903163AApparatus and method of controlling the environmental temperature near semiconductor devices under testMICRON TECHNOLOGY INC·Filed 1996·Granted May 11, 1999·45 cites·21 claims
- 0272US6356094B1Automated multi-chip module handler, method of module handling, and module magazineMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 12, 2002·12 cites·18 claims
- 0367US6229323B1Automated multi-chip module handler, method of module handling, and module magazineMICRON TECHNOLOGY INC·Filed 1998·Granted May 8, 2001·20 cites·23 claims
- 0466US12207411B2Printed wiring boards, printed wiring board assemblies, and electronic systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 21, 2025·0 cites·19 claims
- 0564US2025159813A1Printed circuit boards, and related assemblies and electronic systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0657US2025234452A1Module-level thermal management mechanismMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0757US2025157885A1Memory module with extended conductive plane for heat dissipationMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0853US6483333B2Automated multi-chip module handler and testing systemMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 19, 2002·4 cites·20 claims
- 0953US2025379157A1Label support structure including a filler materialMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1049US2024305026A1Connector assembly with integrated data and backup energy connectionsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1146US2024117855A1A damper for a printed circuit board assemblyMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1244US11997782B2Thermally conductive label for circuitMICRON TECHNOLOGY INC·Filed 2021·Granted May 28, 2024·0 cites·17 claims
- 1343US2023216225A1Connector for coupling a capacitor to a printed circuit board assemblyMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1442US2006197544A1Test sockets, test systems, and methods for testing microfeature devicesMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 1542US2006197545A1Test sockets, test systems, and methods for testing microfeature devicesMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 1641US7256595B2Test sockets, test systems, and methods for testing microfeature devicesMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 14, 2007·1 cites·21 claims
- 1736US6750666B2Automated multi-chip module handler and testing systemMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 15, 2004·0 cites·20 claims
- 1835US6414503B1Magazine for carrying a plurality of multi-chip modulesMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 2, 2002·0 cites·11 claims
Join the waitlist — get patent alerts
Get an alert when Mark A. Tverdy files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →