Inventor · disambiguated record
Makoto Ueki
Also filed as: UEKI MAKOTO
14 granted patents·10 pending applications·124 citations·filing 2003–2019
91Inventor score
Files withRENESAS ELECTRONICS CORP8NEC CORP5UEKI MAKOTO5SONY SEMICONDUCTOR SOLUTIONS CORP2KIMURA MASATOSHI1
Top patents by PatentIndex Score
24 records- 0196US8558334B2Semiconductor device and method of manufacturing the semiconductor deviceUEKI MAKOTO·Filed 2012·Granted Oct 15, 2013·39 cites·10 claims
- 0289US8492266B2Semiconductor device having insulating film with surface modification layer and method for manufacturing the sameUEKI MAKOTO·Filed 2011·Granted Jul 23, 2013·9 cites·6 claims
- 0387US9337093B2Method of manufacturing semiconductor deviceOSHIDA DAISUKE·Filed 2011·Granted May 10, 2016·10 cites·4 claims
- 0486US8080878B2Semiconductor device having insulating film with surface modification layer and method for manufacturing the sameUEKI MAKOTO·Filed 2009·Granted Dec 20, 2011·10 cites·14 claims
- 0581US8198730B2Semiconductor device and method of manufacturing the sameTAGAMI MASAYOSHI·Filed 2008·Granted Jun 12, 2012·9 cites·20 claims
- 0681US7545040B2Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor deviceNEC CORP·Filed 2003·Granted Jun 9, 2009·25 cites·8 claims
- 0780US9679647B2Semiconductor memory device including a resistance change element and a control circuit for changing resistance of the resistance change elementRENESAS ELECTRONICS CORP·Filed 2016·Granted Jun 13, 2017·6 cites·10 claims
- 0878US8742521B2Semiconductor device and method of manufacturing the semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Jun 3, 2014·3 cites·6 claims
- 0976US12339334B2Magnetoresistive element and semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Jun 24, 2025·1 cites·11 claims
- 1069US10217800B2Resistance change memory deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Feb 26, 2019·1 cites·7 claims
- 1158US6916203B2Water-proof modular connectorNEC CORP·Filed 2004·Granted Jul 12, 2005·10 cites·8 claims
- 1257US8791751B2Semiconductor integrated circuit and method of reducing power consumptionRENESAS ELECTRONICS CORP·Filed 2013·Granted Jul 29, 2014·1 cites·11 claims
- 1353US2009203208A1Copper alloy for wiring, semiconductor device, method for forming wiring, and method for manufacturing semiconductor deviceNEC CORP·Filed 2009·Application pending·0 cites
- 1448US2009014887A1Method of producing multilayer interconnection and multilayer interconnection structureNEC CORP·Filed 2007·Application pending·0 cites
- 1548US2009278178A1Semiconductor device and method for fabricating the sameNEC CORP·Filed 2008·Application pending·0 cites
- 1648US2012061844A1Copper alloy for wiring, semiconductor device, method for forming wiring, and method for manufacturing semiconductor deviceUEKI MAKOTO·Filed 2011·Application pending·0 cites
- 1745US2010025852A1Semiconductor device and method for manufacturing the sameUEKI MAKOTO·Filed 2007·Application pending·0 cites
- 1841US10115772B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted Oct 30, 2018·0 cites·18 claims
- 1941US2021318395A1Magnetoresistive elementSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Application pending·0 cites
- 2040US9558824B2Semiconductor device and operating method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted Jan 31, 2017·0 cites·7 claims
- 2140US2011316161A1Method of producing a dual damascene multilayer interconnection and multilayer interconnection structureOHTAKE HIROTO·Filed 2011·Application pending·0 cites
- 2239US2012254408A1Non-transitory computer readable storage medium, information communication device and link methodKIMURA MASATOSHI·Filed 2012·Application pending·0 cites
- 2335US2016005792A1Semiconductor memory device, and method for producing the sameRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 2434US2015279923A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →